DateThursday, February 22nd, 2018
8:30 am to 6:00 pm
Plenary: Dr. Nicky Lu
Attendee Registration Fee
$40 IEEE members, students, retired, unemployed,
Add $10 more after Feb. 9th
Texas Instruments Auditorium
Building E Conference Center,
2900 Semiconductor Drive,
Santa Clara, California, USA
A Moore's Law for Packaging
Date and Time: March 21, 2018 11:00 AM EST
Presenter: Subramanian Iyer
Host: Alan Huffman
While Silicon has scaled aggressively by over a factor of a few thousand over the last six decades the progress in packaging has been more modest – a linear factor 4-5 in most cases. In this talk, we will examine the reasons for this lag and what we are doing to fix this imbalance. Packaging is undergoing a renaissance where chip-to-chip interconnects can approach the densities of on-chip interconnects. We will discuss the technologies that are making this happen and how these can change our thinking on architecture and future manufacturing. Specifically, we will discuss two embodiments: Silicon as the next generation packaging substrate, and Flexible electronics using fan-out wafer level processing. Finally, we’ll discuss how these developments can help put some intelligence into Artificial Intelligence and bring about changes in Medical Engineering.
The Electronics Packaging Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. There are a number of opportunties for you to get involved in the various activities.
For a complete list, please refer to the Society website.
If you are interested please contact the EPS Executve Office.
Membership in the IEEE and EPS provides a world of value, including access to the industry's most essential technical information, networking opportunities, career development tools, and many other exclusive benefits.
· Free on-line subscription to
· On-line access to IEEE RFID Virtual Journal
· Discounts on technical journals
· Free subscription to EPS Newsletter
· Free subscription to IEEE Spectrum Magazine
· Discounts on Conference registration
Most accessed documents for the month of December, 2017
Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland
Publication Year: 2017, Page(s):1891 - 1898
Publication Year: 2015, Page(s):1339 - 1349
John H. Lau ; Ming Li ; Dewen Tian ; Nelson Fan ; Eric Kuah ; Wu Kai ; Margie Li ; J. Hao ; Yiu Ming Cheung ; Zhang Li ; Kim Hwee Tan ; Rozalia Beica ; Thomas Taylor ; Cheng-Ta Ko ; Henry Yang ; Yu-Hua Chen ; Sze Pei Lim ; Ning Cheng Lee ; Jiang Ran ; Cao Xi; Koh Sau Wee ; Qingxiang Yong
Publication Year: 2017, Page(s):1729 - 1738
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Apr 15, 2018 - Apr 18, 2018
May 22, 2018 - May 25, 2018
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
San Diego, CA USA
May 29, 2018 - Jun 1, 2018