Registration is Now Open for ECTC 2019

  The premier international packaging, components, and 

microelectronics systems technology conference

The 2019 ECTC includes:

·       41 technical sessions covering all aspects of advanced packaging:

o   36 technical sessions covering wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics.

o   4 interactive presentation sessions 

o   1 student interactive presentation session

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