The premier international packaging, components, and
microelectronics systems technology conference
The 2019 ECTC includes:
· 41 technical sessions covering all aspects of advanced packaging:
o 36 technical sessions covering wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics.
o 4 interactive presentation sessions
o 1 student interactive presentation session