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Info on Society member benefits, HIR, conferences and more!

When: February 20 &21, 2020

Where: SEMI Headquarters: 673 South Milpitas Blvd, Milpitas CA USA

Thursday, February 20, 2020: HIR Symposium

Time: 8:30 AM – 6:00 PM

Who Should Attend: Open to the General Public

Plenary Speakers and Technical Working Group Representatives (from Intel, Boeing, Fraunhofer, NASA, Infineon, Google, Advantest, ASE, ITRI, SEMI, UI-UC, U-Md, UCLA, more)

Friday, February 21, 2020: HIR Technical Working Group Meeting and Open House

Time: 8:30 AM – 4:00 PM

Who Should Attend: All HIR Technical Working Group members and anyone interested in participating or learning more about the Heterogeneous Integration Roadmap.

The purpose is to provide a structured forum for interaction, collaboration and feedback.

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From January 1 - June 1, 2020, the Best Paper winners from ECTC 2019 will be available to everyone!

1)       Best Session Paper

Perceval Coudrain, Jean Charbonnier, Arnaud Garnier, Pascal Vivet, Rémi Vélard, Andrea Vinci, Fabienne Ponthenier, Alexis Farcy, Roselyne Segaud, Pascal Chausse, Lucile Arnaud, Didier Lattard, Eric Guthmuller, Giovanni Romano, Alain Gueugnot, Frédéric Berger, Jérôme Beltritti, Therry Mourier, Mathilde Gottardi, Stéphane Minoret, Céline Ribière, Gilles Romero, Pierre-Emile Philip, Yorrick Exbrayat, Daniel Scevola, Didier Campos, Maxime Argoud, Nacima Allouti, Raphaël Eleouet, César Fuguet Tortolero, Christophe Aumont, Denis Dutoit, Corinne Legalland, Jean Michailos, Séverine Chéramy,  Gilles Simon - CEA LETI

“Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures”

2). Best Interactive Presentation Paper

H.T. Hung, S.Yang, I. A. Weng, Y. H. Chen, C. R. Kao-National Taiwan University, Y.H. Chen-Unimicron Corp.

“Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnection”

3). Outstanding Session Paper

Horst Theuss, Christian Geissler, Franz-Xaver Muehlbauer, Claus von Waechter, Thomas Kilger, Juergen Wagner, Thomas Fischer, Ulf Bartl, Stephan Helbig, Alfred Sigl, Dominic Maier, Bernd Goller, Matthias Vobl, Matthias Herrmann, Johannes Lodermeyer, Ulrich Krumbein - Infineon Technologies AG; Alfons Dehe - Hahn-Schickard 

A MEMS Microphone in a FOWLP” 

4). Outstanding Interactive Presentation Paper

Jiefeng Xu, Scott McCann, Huayan Wang, Jing Wang, VanLai Pham, Stephen R. Cain, S.B. Park-The State University of New York at Binghamton, Gamal Refai-Ahmed-Xilinx, Inc.

An Assessment of Electromigration in 2.5D Packaging

To highlight the best/outstanding papers selected from each of the EPS flagship conferences (ECTC, ESTC and EPTC), travel funding will be provided to attend another EPS flagship conference.  One author will be invited to present their best/outstanding paper (up to US$2,125 for intercontinental travel and up to US$1,375 for intracontinental travel). Only one trip per paper will be allowed (one co-author can be invited; preference for original presenter) and can only be taken within 12 months of award.  

On behalf of the Program and Executive Committees, it is my pleasure to invite you to IEEE’s 70th Electronic Components and Technology Conference (ECTC), which will be held at Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA from May 26 - 29, 2020. This premier international annual conference, sponsored by the IEEE Electronics Packaging Society (EPS), brings together key stakeholders of the global microelectronic packaging industry, such as semiconductor and electronics manufacturing companies, design houses, foundry and OSAT service providers, substrate makers, equipment manufacturers, material suppliers, research institutions, and universities, all under one roof. More than 1,500 people have attended ECTC in each of the last three years. 

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The IEEE EPS President’ Panel explores the path of packaging technologies towards the future.  Visions of future packaging technologies are presented by students and discussed with EPS expertsin the field. The best student packaging visions will be selected by an expert panel recruited from EPS and ECTC technologists and awarded the EPS FPV Awards at the panel session.  In the frame of the EPS packaging technology vision contest, selected students with ECTC 2020 papers will be invited to propose their electronics packaging technologies visions to a review board assembled around the EPS President from IEEE EPS experts. They will prepare a short slide set in advance of the full paper submission. The selected/invited students will present their slide set with the bigger picture of their research work and their visions for the future (about the impact of their research field and work expected) at the panel session. Student ECTC authors are specifically encouraged to apply. The EPS President’s Panel provides an enhanced opportunity to dialog with our younger colleagues in order to involve them and their way of thinking as early as possible into the discussion on future packaging technologies within the EPS. The result is to identify significant future packaging technologies in order to best serve IEEE and the electronics community by motivating and involving the very high potential of our students.

If your student paper has been accepted to ECTC 2020 and you are interested in participating please inform us as soon possible with the following information

First Student Author - Name:

First Student Author - Affiliation:

First Student Author - email:

ECTC 2020 Paper Title:


Karlheinz Bock: EPS Emerging Technologies Technical Committee Chair 

Denise Manning: EPS Executive Director 

Sponsored by IEEE EPS

Co-located with the 70th ECTC 2020 – Joint registrations available at discounted rate

When: May 26 - 29, 2020

Where: Walt Disney World Swan & Dolphin Hotel, Orlando, FL, USA

Register Here

Tuesday, May 26, 2020: Professional Development Courses and Workshops

Time: 8:00 AM – 5:00 PM

- Eighteen, half-day PDCs offered in collaboration with co-located ECTC

- Research Workshop on Fundamentals of Two-Phase Flow

- Heterogeneous Integration Roadmap Workshop

Wednesday, May 27 – Friday May 29, 2020: Technical Sessions

Time: 8:00 AM – 5:00 PM

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IEEE IEMT 2020 is inviting you to submit an abstract for the 39th IEMT 2020 to be held in Le Méridien, Putrajaya, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from Electronic Packaging Society (EPS) of IEEE, Santa Clara Valley Chapter. The IEMT typically attracts more than 400 attendees over the world. Last IEMT 2018 in Melaka, Malaysia had 500 attendee, with 100 papers and interactive presentation featured in 16 sessions. 

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From:  David McCann/Incoming EPS VP Technology

It is great to be a part of the Technology Working Group (TWG).   Pat Thompson led the definition of goals of the TWG for the next three years and we will be focusing on identifying and implementing best methods to execute successfully to those goals. 

Our primary short/medium term goal is to increase the impact of our Technical Committees (TCs) and to help them become a go-to source of technical content for the Packaging Engineering EPS universe.  To that end, we are updating each TC website to the new EPS format and then will be uploading new content topical to each TC’s field on at least a quarterly frequency.  Denise Manning has added a link (thanks!) to the new webpage format for interested people to click on to get involved with the TC of their choice. 

We have started quarterly meetings for the TC leaders to align on our goals and share learning.   We will have two quarterly meeting times so those around the world can join at a convenient time in their geography. 

A draft charter for TC’s has been completed (thanks to Raj Pulugurtha!) and reviewed with the TC leaders.   The goal of the charter is to align TC leaders and members to high-level expectations of the TC’s.

Bill Chen has done a great job of linking the TC and HIR team leads together and we look forward to increasing collaboration there and putting links on the TC web page for the related HIR web page and vise versa.

We have also circulated a matrix of initiatives and activities that EPS is engaged in to the TC leaders so they have greater awareness of collaboration opportunities with related technology groups.

Lastly, we are excited to be working with the ECTC on a Photonics focus in Orlando at the next conference and with Avi Bar-Cohen on for engaging EPS to be a technical sponsor of the IEEE International Conference on Quantum Computing and Engineering during IEEE Quantum Week. 



I look forward to working with you all.  Please contact me at davidmccann11@gmail.com.

IEEE EPS Technical Committee Green Electronics is recruiting new members.

The electronics industry is taking on environmental issues more proactively than many other industries and other players. Help define and communicate the role of the electronics packaging community in making electronic products greener, and in employing the right electronics based solutions to achieve sustainable development goals.

Join the committee to establish this worldwide exchange – either because you are already an expert or because you feel that more engineers should engage in this work. Medium term goals are to promote more environmental contributions to the CPS flagship conferences (ECTC, EPTC and ESTC) and to organize input to the Heterogeneous Integration Roadmap (HIR Roadmap).

Should we get a critical mass together, a face-to-face meeting could be scheduled at the Electronics Goes Green conference, September 1-3 2020 in Berlin, Germany.

Contact: nils.nissen@izm.fraunhofer.de

IEEE 3DIC 2019

Paul Franzon, paulf@ncsu.edu, Tetsu Tanaka, ttanaka@bme.tohoku.ac.jp

The IEEE International 3D Systems Integration Conference was held in Sendai Japan, October 8-10, 2019.  Dr. Tetsu Tanaka, the conference chair.  We had 221 attendees, including 76 speakers and 75 exhibitors.   In the conference, the best student paper was given to Mr. Sreejith K. Rajan of GA tech. Student poster awards were given to Ms. Rui Liang of Tohoku Univ, Ms. Hanna Soneda of Tokushima Univ, Mr. Shunsuke Hanatani of Kansai Univ, and Mr. Sungho Lee of Tohoku Univ.

Highlights of the conference included the following:

-          A special ceremony honoring Prof. Mitsumasa Koyanagi and Dr. Peter Ramm on their receiving the IEEE Electronics Packaging Award for their contributions to 3DIC technology. They both gave very interesting talks with a historical perspective.

-          A plenary talk by Prof. Subramanian Iyer, UCLA,  on the upcoming dielets “craze.”

-          A plenary talk by Dr. Timothy Hancock, DARPA, on Heterogeneous and 3D integration at DARPA

-          A plenary talk by Prof. Masayuki Ohzeki, Tohoku University, on Quantum Annealing

-          Invited talks by

o   Dr. Yoshihisa Kagawa, Sony, 3D Integration Technologies for the Stacked CMOS Image Sensors

o   Dr. Akia Matsuzawas, Tech Idea, Universal ADC for Sensor Applications

o   Dr. Chuei-Tang Wang, TSMC, Power-Performance Advantages of InFO Technology for Advanced System Integration

o   Dr. Farhang Yazdani, BroadPak, Advances in Substrate Manufacturing for AI/HPC and 5G Packaging

o   Prof. Tadao Nakamura, Keio University, An Introduction to Marching Memory (MM)

o   Dr. Ho-Young Son, SK Hynix, Future Challenges to Packaging Technologies of High Bandwidth Memory

o   Dr. Pascal Vivet, CEA-LETI, Monolithic 3D as an Alternative to Advanced CMOS Scaling: Technology, Design and Architecture Perspectives

o   Prof. Paul Franzon, NC State University, Future Directions for 3DIC Technology and Design

o   Prof. Tadatomo Suga, Innovative Bonding Technology for 3D Integration


There were two social events, including a Sake Barrel opening jointly done by Peter and Mitsu!

We look forward to 3DIC 2020 to be held in California in October 2020.  Please contact us if you are interested in participating.


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