Title:Holistic Understanding of Thermo-Mechanical challenges from Package to System to Maximize Silicon Performance
Presenter: Gamal Refai-Ahmed
Date and Time: March 4th at 3:00 PM EST
Abstract: This presentation is addressing the impact of the assembly and manufacturing technology and direction on the advancing packaging Mechanical integrity and its thermal characterizations. In this talk, the audiences will be able to see clearly the full picture to answer the question of will Lidded or Lidless Advanced Packaging have better Thermo-Mechanical Characteristics?. The answer to this question needs to have a full understanding of the manufacture and assembly, materials behavior, the cost, the mechanical stresses, the end user application and the target thermal performance. It is not a surprise to find a wrong direction can impact the package performance and lose more than 30% to 50% of its performance.