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Symposium Date: Wednesday, 23 February 2022

Working Group Dates: Thursday-Friday, 24-25 February, 2022

Time each day: 7:30 AM – 12:30 PM (PST)

Cost: none

Location: On the Internet (via Zoom)

For more information including Registration

Zoom Details will be provided to all Registrants prior to the Conference

The IEEE’s Heterogeneous Integration Roadmap is 600+ pages of details across all areas of advanced packaging, covering pre-competitive information for industry, working engineers, and academia. It is intended to guide product development over the next decade, with projections out through 2034. It is freely available for download.

The 2022 IEEE EPS membership certificates are now available.

EPS Membership Certificate

Steps to download and print your certificate:

  • Log into IEEE Collabratec at ieeecollabratec.org
  • Click on your name in the top right of the screen and select “IEEE Membership Certificates”.
  • From the “Member Certificates” page select your certificate to download the PDF.
  • Open the PDF and print.

The EPS Membership Team seeks your assistance to serve as a reference to support our members' potential senior member applications.

If you are willing to serve as a reference, please provide your member details here.

Be a reference for a Senior Member Application

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Date: May 31 – June 3, 2022

Location:  The Sheraton San Diego Hotel and Marina

     1380 Harbor Island Drive

                 San Diego, CA 92101

Registration

Sponsors

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The 9th Electronics System-Integration Technology Conference (ESTC) will be taking place in Sibiu, Romania September 13 - 16, 2022.

The deadline for submission of abstracts has been extended to March 1, 2022.

The ESTC 2022 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results. 

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IEEE Canada is hosting a webinar series on Technology Leadership.  We are inviting professional associations, think tanks, governmental agencies, and other institutions to participate and contribute speakers.   This webinar series is a platform bringing our thought leaders from different stakeholders, from all walks of life to present their views and advocate their positions on science, technology, society, and future economy.   It will be open and free to the general public.  Many, among the audience, will be members of IEEE.

Date:                    Tuesday February 22, 2022

Time:                    03:00 PM to 04:00 PM EDT

Speaker:              Dr. Amr Helmy

Topic:                   How can metal optics enable CMOS scalability within System in a Package?

Registration:      https://events.vtools.ieee.org/m/298800

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Date: 24 Feb 2022

Time: 10:15 AM to 06:30 PM (All times are Europe/Zurich)

Location: microPark Pilatus (C/O CSEM SA)

    Industriestrasse 23

    Alpnach Dorf, Switzerland

    Switzerland 6055

 During this workshop, which will be conducted as a joint event between IEEE EPS chapter Switzerland, Swiss photonics and CSEM, we will take a deeper look at precision assembly solutions from the industry and from development partners. Whether it be an active or a passive assembly of photonics components, it requires in many cases precision alignment of e.g., lasers, waveguides, detectors and lenses.

For more information and to Register

Date:  March 2, 2022

Time: 12:00 pm EST

Speaker: Dr. Matt Wahila, PhD

Abstract: Hard X-ray Photoelectron Spectroscopy (HAXPES) is an extremely powerful analytical tool for characterizing and understanding materials. Synchrotron HAXPES typically uses a tunable, focused X-ray beam in the tender spectrum (2.0 keV to 7.5 keV) to probe the depth-dependent chemical, electronic, and molecular structure near the surface of material with a wide range of probing depths (approx. 3 to 30 nm below the surface). The spot size at the sample can be focused to as small as ~50 μm. Unfortunately, HAXPES remains a relatively unknown and often underutilized technique due to its requirement of a large synchrotron facility.

Register here

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The Santa Clara Valley EPS chapter invites members and guests to join them for one or more of their upcoming WebEx webinars.

Topics include:

-- On-Shoring the Next Generation of Advanced Packaging

-- Data Centers At Meta: Heterogenous Integration Driven By AI/ML And Network Applications 

-- To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets

-- Understanding your Supply Chain: What is Hiding There

-- Delivering Reliable Systems: Automotive and Mobile Electronics

 For more information, or to join our Dlist, visit https://ieee.org/scveps.

Attila Bonyár, IEEE Senior Member

Department of Electronics Technology, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Budapest, Hungary; bonyar@ett.bme.hu

Abstract

In the past couple of decades, the development of plasmonic nanosensors underwent rapid progress, both in the fields of fabrication, integration, and realized applications. Localized surface plasmon resonance imaging (LSPRi) promises the possibility of high-throughput biomolecule sensing integrated into miniaturized point-of-care (PoC) devices. This article provides an overview of the working principle of LSPRi devices and discusses the key requirements for nanoplasmonic sensors elements to realize these goals. The possibilities and limitations of available nanofabrication technologies are also discussed.

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