Sixth Annual Heterogeneous Integration Roadmap Symposium
Key Talks on the Future of Heterogeneous Integration:
-- 8 plenary talks from NIST, DoD, IBM, Samsung, Intel, AMD, ITRI, Penn State, working group reports ...
-- Thursday-Friday, February 23-24, 2023
-- In-person at SEMI World Hdqtrs, Milpitas, and via WebEx
-- Cost: $75 (includes lunches) or $40 (via WebEx)
-- "HI Platform for Next Generation Computing (‘Beyond Moore’)" Dr Moonsoo Kang, Executive Vice President, Advanced Packaging Business, Samsung Electronics
-- "HI Development – Interdisciplinary Innovations" Dr. Xin Wu, Corporate Vice President, Advanced Micro Devices
-- "AI for Chip Technology and Heterogeneous Integration" Dr. Wei Chen Lo, Deputy General Director, Electronic/Opto System Rsch Labs, ITRI
-- "High-Bandwidth Interconnect for an Open Chiplet Ecosystem" Dr. Debendra Das Sharma, Senior Fellow, Intel Corp.
-- "The CHIPS Act-related National Advanced Packaging Manufacturing Program" Dr Scott Sikorski, Technology Business Development Executive, IBM Corp.
-- "HI for the Next Decade – An Academic Perspective" Prof. Madhavan Swaminathan, Center for Heterogeneous Integration & EE Dept Head, Penn State University
... plus talks from NIST, Dept of Defense; key updates from HI Roadmap Working-Groups