The 73rd ECTC Program is Now Online
The premier international packaging, components, and microelectronics systems technology conference.
ECTC is the only event that offers an outstanding array of packaging technology information and four full days of engaging seminars. The over 350 technical papers cover advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, quantum electronics, flexible and printed electronics.
The 2023 Program Includes:
- 41 Technical sessions with a total number of 350+ technical papers including:
- 5 Interactive Session including one student session
- 9 Special invited sessions plus a diversity panel and a Young Professionals event
- 16 CEU-approved Professional Development Courses
To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group to receive the latest updates on the most important topics in microelectronic packaging.
Program details can be found here
Professional Development Courses