Title: Implantable Electronics: Emerging Packaging Needs, Challenges and Recent Industry Breakthroughs
Date: February 6, 2020
Time: 11:00 AM EST
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Neuroprosthetic technologies aim to continuously interface with the nervous system to restore lost motor or sensory functions from injury and diseases. Implantable biosensors continuously monitor health conditions to provide continuous close-loop feedback to such systems. Such technologies have already been helping patients with heart disease, hearing and vision loss, diabetes, amputees, patients with spincal cord injury, and other brain-related disorders. The first part (by Prof. Ranu Jung, FIU, Miami) will describe emerging neuroprosthetic technologies and the needs for advanced packaging solutions for miniaturized functional integration in implantable electronics. Miniauturized chip-scale hermetic packaging is the key to realize implantable electronics. Glass micro bonding combined together with hermetic through glass vias (TGVs) helps designing a chronically implantable electronics device. The development and validation of this technology will be presented by Schott Primoceler (Ossi Lahtinen). The last part will highlight a recent fully-implantable bioelectronic implant by by Senseonics Inc. in collaboration with Integrated Device Technology (a Renesas Company). In this talk, Gaurav Mehrotra (Renesas USA) will highlight the system integration and packaging challenges associated with Eversense CGM.
The webinar will thus cover needs, technologies and leading-edge productization of implantable electronics.