EPS Santa Clara Valley Chapter Webinars

Upcoming webinars from the EPS Santa Clara Valley (SCV) Chapter. If you Chapter is interested in co-sponsoring, please contact the SCV Chapter Chair - annette@ieee.org.

You can register here: https://ieee-region6.org/scv-eps/ 

  

Virtual for 2021

California time

Speaker location

Title

Speaker

speaker affiliation

Jan 28, 2021

Noon

St. Paul, MN

High performance & reliable aerosol jet printed 3D interconnects for bare die & components

Bryan Germann

bgermann@optomec.com

Optomec

Feb 11, 2021

Noon

San Jose

Design analysis of chiplet interfaces for heterogenous systems

Wendem Beyene, DL

wendem@gmail.com

Feb 24-26, 2021

Half days for 3 days

Binghamton

HIR 4th Annual Meeting

12 Working Group sessions over 3 days

william.chen@aseus.com

Mar 18, 2021

Noon

Auburn, AL

Additively-printed multilayer flexible substrates with Z-axis interconnects

Pradeep Lall, DL

lallpra@auburn.edu

Auburn U.

April 15, 2021

Noon

Helsinki, Finland

Sustainable electronics

Mervi Paulasto-Krockel, DL

mervi.paulasto@aalto.fi

Aalto U., Finland

May 13, 2021

Noon

Boston, MA

Packaging for quantum computing

Rabindra Das

rabindra.das@ll.mit.edu

MIT Lincoln Lab

June 10, 2021

8:00 AM

St. Florian, Austria

Low temperature wafer bonding

Jurgen Burggraf

j.burggraf@evgroup.com

EVG

June 17, 2021

8:00 AM

Enschede, Netherlands

Photonics assembly

Brad Snyder, Jeroen Duis

bradley.w.snyder@gmail.com

PHIX