EPS Santa Clara Valley Chapter Webinars
Upcoming webinars from the EPS Santa Clara Valley (SCV) Chapter. If you Chapter is interested in co-sponsoring, please contact the SCV Chapter Chair - annette@ieee.org.
You can register here: https://ieee-region6.org/scv-eps/
Virtual for 2021 |
California time |
Speaker location |
Title |
Speaker |
speaker affiliation |
|
Jan 28, 2021 |
Noon |
St. Paul, MN |
High performance & reliable aerosol jet printed 3D interconnects for bare die & components |
Bryan Germann |
Optomec |
|
Feb 11, 2021 |
Noon |
San Jose |
Design analysis of chiplet interfaces for heterogenous systems |
Wendem Beyene, DL |
||
Feb 24-26, 2021 |
Half days for 3 days |
Binghamton |
HIR 4th Annual Meeting |
12 Working Group sessions over 3 days |
||
Mar 18, 2021 |
Noon |
Auburn, AL |
Additively-printed multilayer flexible substrates with Z-axis interconnects |
Pradeep Lall, DL |
Auburn U. |
|
April 15, 2021 |
Noon |
Helsinki, Finland |
Sustainable electronics |
Mervi Paulasto-Krockel, DL |
Aalto U., Finland |
|
May 13, 2021 |
Noon |
Boston, MA |
Packaging for quantum computing |
Rabindra Das |
MIT Lincoln Lab |
|
June 10, 2021 |
8:00 AM |
St. Florian, Austria |
Low temperature wafer bonding |
Jurgen Burggraf |
EVG |
|
June 17, 2021 |
8:00 AM |
Enschede, Netherlands |
Photonics assembly |
Brad Snyder, Jeroen Duis |
PHIX |