HIR Symposium and Workshop

 

Date: Wednesday, 24 February 2021
Time: 7:30 AM – 12:30 PM PST
    (followed by two days of optional working-group meetings)
Cost: none
Location: On the Internet (via Zoom)
Reservations: eps2102sym.eventbrite.com

The IEEE’s Heterogeneous Integration Roadmap is 600+ pages of details across all areas of advanced packaging, covering pre-competitive information for industry, working engineers, and academia. It is intended to guide product development over the next decade, with projections out through 2034.

Program Outline: (expect updates over the next several weeks, to add topics and speakers)
    (all times USA-Pacific time – PST)
07:30 AM – Welcome & Thanks to organizers & Sponsors
07:40 AM – HIR 2020 Achievement Retrospective (Report Card)
08:20 AM – Plenary 1: Ajit Manocha, President and CEO, SEMI
09:00 AM – Plenary 2: DARPA Speaker
09:40 AM – break
09:50 AM – Plenary 3: Supercomputer speaker
10:30 AM – Plenary 4: AI Speaker
11:10 AM – Plenary 5: HIR Science Speaker
11:50 AM – Wrap-Up – Charge to Heterogeneous Integration Roadmap Team – Nicky Lu
12:20 PM – Profile of Day 2 & 3 TWG Workshop agenda

February 25 & 26: TWG workshops: Cross TWG Panels + workshops and Invited Speakers