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BECOME A REVIEWER FOR T-CPMT

T-CPMT provides the latest information in electronics packaging. We are inviting you to become a reviewer and to maintain the high standard for the journal. If you are interested in becoming a reviewer, please update (or create) your author/reviewer account on the T-CPMT ScholarOne submission site: https://mc.manuscriptcentral.com/ieee-tcpmt.  It is especially important to indicate your areas of expertise with several keywords.  These keywords will be accessed by Associate Editors searching for reviewers in the database, based on the keywords of the submissions received. Feel free to also send us an email to alert us to your availability to review, and we will pass on your account information to the Associate Editors in charge of new manuscript submissions that match your area.

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The 21st Electronics Packaging Technology Conference (EPTC 2019) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2019 will feature keynotes, technical sessions, short courses, forums, an exhibition, social and networking activities, including a banquet for all attendees. It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet with leading international experts.

 

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The submission deadline for the Electrical Performance of Electronic Packaging and Systems Conference EPEPS2019 has been extended to July 24, 2019.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. EPEPS is jointly sponsored by IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society and IEEE Antennas and Propagation Society. Submitted papers should describe new technical contributions related to the area of electrical performance of high‐performance interconnect systems, covering:

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Sep 5, 2019 - Sep 6, 2019
Sep 14, 2019 - Sep 18, 2019
Sep 15, 2019 - Sep 20, 2019

 

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At the June 1, 2019 EPS Board of Governors meeting the Board approved a motion to revise the Society's Field of Interest to align with the recent Society name change. The revised Field of Interest approved by the Board is below.

The EPS field of Interest includes all aspects of packaging and system integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components; addressing signal and power delivery, thermal and mechanical engineering of such systems including the materials and reliability of integrated systems. The Society drives science, technology, engineering, test, modeling, simulation, design, manufacturing, interconnection and performance of integrated systems and their applications. It sponsors and reports on electronic packaging education and research worldwide.

For reference, the current FOI can be found on the EPS website

Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification.