EPEPS Call for Papers

The submission deadline for the Electrical Performance of Electronic Packaging and Systems Conference EPEPS2019 has been extended to July 24, 2019.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. EPEPS is jointly sponsored by IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society and IEEE Antennas and Propagation Society. Submitted papers should describe new technical contributions related to the area of electrical performance of high‐performance interconnect systems, covering:

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