At the June 1, 2019 EPS Board of Governors meeting the Board approved a motion to revise the Society's Field of Interest to align with the recent Society name change. The revised Field of Interest approved by the Board is below.
The EPS field of Interest includes all aspects of packaging and system integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components; addressing signal and power delivery, thermal and mechanical engineering of such systems including the materials and reliability of integrated systems. The Society drives science, technology, engineering, test, modeling, simulation, design, manufacturing, interconnection and performance of integrated systems and their applications. It sponsors and reports on electronic packaging education and research worldwide.
For reference, the current FOI can be found on the EPS website
Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification.