Webinars Hosted by the EPS San Diego Chapter
Title: Additive Manufacturing of Electronic Systems: RF to THz
Dr. Premjeet (“Prem”) Chahal, Michigan State University, East Lansing, MI, USA
Date: Thursday, July 16, 2020, Time: 5:00 - 6:30 PM (PDT)
Registration Link:https://meetings.vtools.
Abstract: Additive manufacturing (AM), often referred to as 3D printing, is a process of building parts layer by layer rather than using traditional molding or subtractive methods. It is revolutionizing how critical parts get manufactured, fast prototyping, reduced waste, allows custom designs, easier design adjustments, and parts can be printed as a single unit. Once employed purely for prototyping, AM is now increasingly used for spare parts, small series production, and tooling. With recent advances in print resolution, the ability to print multiple materials simultaneously, and the ability to print low- and high-temperature materials have opened the opportunity to design and manufacture the next generation of electronic systems. We are investigating AM to realize high-functional density high-frequency systems by integrating different device technologies within a single unit through a continuous build-up process. The process includes integrating active and passive elements, signal and power distribution, optics, MEMS, and thermal cooling and isolation, etc. Novel prototyping materials, additive manufacturing strategies, and heterogeneously integrated 3D compact systems have been developed and demonstrated by our lab. This talk will present examples of high frequency circuits (RF to THz) fabricated using AM in our lab, and key advantages and disadvantages of AM for RF systems integration will be highlighted.
Bio: Dr. Premjeet (“Prem”) Chahal received the B.S. and M.S. degrees in electrical engineering from Iowa State University, Ames, IA, USA, and the Ph.D. degree in electrical engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 1999. He was a Senior Researcher with Raytheon, Dallas, TX, USA, from 1999 to 2006, and Abbott Laboratories, Abbott Park, IL, USA, from 2006 to 2008, where he developed many new technologies for sensing, devices, packaging, and components. He joined Michigan State University, East Lansing, MI, USA, in 2009, as a Faculty Member, where he has been an Associate Professor since 2015. He has authored more than 150 refereed technical publications and holds nine U.S. patents. His current research interests include terahertz & millimeter-wave electronics, RF-based sensors, RF MEMS, RF-optical devices, and microwave and millimeter-wave systems packaging. Dr. Chahal was a recipient of the 2012 DARPA Young Faculty Award and the 2016 Withrow Teaching Excellence Award.
Note: WebEx URL will be sent out on July 15, 2020 evening to those who register before the event.
Title: Adding a New Sensing Dimension to Soft Electronics: From the Skin to Below the Skin
Dr. Sheng Xu, UCSD, San Diego, CA, USA
Date: Wednesday, August 12, 2020, Time: 5:00 - 6:30 PM (PDT)
Registration Link: https://meetings.vtools.
Abstract: Soft electronic devices that can acquire vital signs from the human body represent an important trend for healthcare. Combined strategies of materials design and advanced microfabrication allow the integration of a variety of components and devices on a stretchable platform, resulting in functional systems with minimal constraints on the human body. In this presentation, I will demonstrate a wearable multichannel patch that can sense a collection of signals from the human skin in a wireless mode. Additionally, integrating high-performance ultrasonic transducers on the stretchable platform adds a new third dimension to the detection range of conventional soft electronics. Ultrasound waves can penetrate the skin and noninvasively capture dynamic events in deep tissues, such as blood pressure and blood flow waveforms in central arteries and veins. This stretchable platform holds profound implications for a wide range of applications in consumer electronics, sports medicine, defense, and clinical practices.