The ITherm 2020 Virtual Conference will be held July 21-23. ITherm 2020 Virtual is packed with many live and recorded activities. Registration fees for the virtual conference are greatly reduced from previous years, and include access to all virtual live and recorded events and an electronic copy of the conference proceedings.
Join us from 12:00-4:00 PM Eastern on July 21st-23rd for daily live events including: 3 Keynote Talks addressing the future of the 3D system integration technology, ethics in AI, and thermal management challenges of aircraft electrification; an Invited Presentation by the recipient of the Richard Chu ITherm Award for Excellence, 3 Technology-Talk sessions providing deep dive talks on high profile topics; and the returning joint ASME K-16 / IEEE EPS Student Design Challenge on additive manufacturing of heat sinks, sponsored by GE. Recorded events will be available from July 21st till August 19th, and include over 180 technical papers in 50 sessions in 4 Technical Tracks; 60+ Student Posters as a highly engaging forum on the latest research; a joint ECTC/ITherm Diversity Panel and Heterogeneous Integration Roadmap workshop.
ITherm CONFERENCE: https://www.ieee-itherm.net/itherm/conference/home
ACCESS TO MATERIALS: Live streaming and on-demand recordings through the ON24 virtual conference environment
LIVE STREAMING HOURS: 12:00 PM – 4:00 PM (EDT), July 21-23, 2020
CONFERENCE RECORDINGS: Available until August 18, 2020
REGISTRATION OPEN NOW: http://www.cvent.com/d/knq090