Title: Second Phase and IMC Variation of Solder Joint under Eelctromigration
Date: July 16th, 2021
Time: 9am -10am (New York) / 9pm-10pm (Taipei)
Presenter: Prof. Kwang-Lung Lin, Department of Materials Science and Engineering, National Cheng Kung University
Abstract: The solder joint, due to its shrinking dimension between the joined items, experiences high current density during application. The athermal electromigration force in combining with the Joule heat will cause a variety of variations to the relatively small dimension solder joint. This talk will present and discuss the effect of electromigration on the recrystallization of second phase and IMC, the effect of current direction on the interfacial IMC formation, and the transformation of IMC under electromigration in solder joint.