July 2022

IEEE IEMT 2022 invites you to submit your work to the 39th IEMT 2022 that will be held in Le Meridian, Putrajaya, Malaysia. It is an international event organized by the IEEE-EPS, Malaysia Chapter, with co-sponsorship from IEEE Electronic Packaging Society (EPS). The IEMT typically attracts more than 400 attendees over the world. The last IEMT 2018 (Melaka, Malaysia) hosted 600 attendees, with 100 accepted papers and interactive presentation featured in 16 sessions. IEMT 2022 welcomes papers covering electronics packaging technology in diverse semiconductor market. This segment includes telecommunication, data center, automotive, EV, healthcare, aerospace, defense and others.

https://www.iemt.com.my/

ABOUT EPTC

The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputed international electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region. It aims to cover the complete spectrum of electronics packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation and AI. EPTC2022 conference will feature keynotes, technical sessions, technology talks, an exhibition and networking activities.

The IEEE ITherm Conference is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2023 will be a physical conference held along with the 73rd ECTC. Joint ITherm/ECTC registrations will be available at a significant discount. All abstracts are followed by full papers to be peer reviewed and published in the IEEE Xplore ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants, covering registration and 2 or 3 night stay at the conference hotel, in order to participate in the Student Poster and Networking Session. ITherm 2023 will also feature keynotes by prominent speakers, vendor exhibits, panel discussions, invited technology talks, ECTC/ITherm joint networking events and short courses, an art-in-science exhibition, and a student design competition.

Abstract Deadline: Sept. 5, 2022

Notification of Acceptance: Oct. 17, 2022

Draft Paper Submission: Dec. 19, 2022

Reviews Returned: Feb. 6, 2023

Final Paper Submission: Mar. 6, 2023

Introduction

Digital Twin has become a commonly used phrase in the context of products, processes, businesses, and more. It was first introduced in 2003 by Dr Michael Grieves, but the term was first defined in the NASA Modelling, Simulation, Information Technology & Processing Roadmap in 2010 (revised in 2012). Thus, the concept primarily evolved in the context of aerospace and manufacturing applications and was later embraced by many other industries such as healthcare. Among the newer technologies, it currently lies on the peak of the expectation curve according to a report by Gartner in 2018.

Abstract — With advancing technology nodes, conventional copper on-chip interconnects are becoming more susceptible to different scattering mechanisms such as sidewall scattering, surface roughness scattering and grain boundary scattering. These scattering mechanisms increase the per-unit-length resistance of the interconnects, thereby leading to increased signal attenuation, latency, and power losses. In order to address these limitations of conventional copper interconnects, more advanced interconnect technologies such as carbon nanotubes and hybrid copper-graphene interconnects are currently being investigated. These newer technologies exploit the enhanced electrical and material properties of novel 2D materials such as graphene to improve the overall conductive properties of the interconnects. However, in order to model the electrical properties of graphene-based interconnects, highly complicated equivalent circuit models are required, the solution of which are extremely time consuming. One approach to mitigate the high computational costs of modeling such novel interconnects is by using artificial neural network models. In this article, we review the current state-of-the-art in artificial neural networks to efficiently model the transient responses of the aforementioned emerging graphene-based interconnects.

The EPS Technical Committees are seeking support from our student members. Any students interested in being the web administrator for one of our Technical Committees please contact the EPS Office.

Web Administrator Role Description:

• Creates website on format used by IEEE EPS Technical Committees

• Keeps Technical Committee membership list up-to-date on website

• Keeps Events Calendar up-to-date on website

• Uploads new technical content and removes out-dated content from the website

• Supports website requests from Technical Committee members. Uses these opportunities for mentoring in interest areas of the web administrator.

• Makes suggestions in Technical Committee meetings on how to make the website more useful to the Packaging community

• Monitors and reports on web site hits in Technical Committee meetings

This is an opportunity to network with professionals in the field as well as gain valuable insight into the Society's activities and focus areas. We look forward to hearing from you!

With the goal of inspiring high school students to consider engineering and other STEM careers, the Sea Air and Land Challenge is an introduction to engineering through the use of robotics. This STEM initiative provides opportunities for students to tackle a tough engineering task while in high school and to learn about some of the tremendous technical careers available to them. It also helps administrators and educators implement a successful STEM program in their schools, even given time, resource or budget constraints. Some advantages of this program are its focus on the engineering design process, accessibility (web-based, lower cost, 1-2 hour driving distance from school), innovation-driven open-sourcing and optional no-cost curriculum.

This STEM initiative was started at Penn State’s Electro-Optics Center located in Freeport, PA, approximately 30 minutes northeast of Pittsburgh, as a response to the need for engineers and has grown to seven states. Nicknamed the SeAL Challenge, the students choose between designing and building a submersible for piloting underwater in the Sea Challenge mission, a drone for flying in the Air Challenge mission or a rover to drive in the Land Challenge mission.