ITHERM 2023 - Call For Papers

The IEEE ITherm Conference is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2023 will be a physical conference held along with the 73rd ECTC. Joint ITherm/ECTC registrations will be available at a significant discount. All abstracts are followed by full papers to be peer reviewed and published in the IEEE Xplore ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants, covering registration and 2 or 3 night stay at the conference hotel, in order to participate in the Student Poster and Networking Session. ITherm 2023 will also feature keynotes by prominent speakers, vendor exhibits, panel discussions, invited technology talks, ECTC/ITherm joint networking events and short courses, an art-in-science exhibition, and a student design competition.

Abstract Deadline: Sept. 5, 2022

Notification of Acceptance: Oct. 17, 2022

Draft Paper Submission: Dec. 19, 2022

Reviews Returned: Feb. 6, 2023

Final Paper Submission: Mar. 6, 2023

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