The 2020 ECTC Virtual Conference will be open until July 7, 2020. Registration is free!
You will have free access to more than 400 presentations featuring an outstanding array of packaging technology, including all aspects of advanced packaging: wafer-level and fanout packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies. There is also a special session on the Heterogeneous Integration Roadmap. More details on how to directly access the HIR workshop can be found here.
ECTC CONFERENCE ENTRANCE PAGE: https://webinars.on24.com/
ACCESS TO MATERIALS: You must click the check box of each session that you would like to view
CONFERENCE OPENS: NOW OPEN!
CONFERENCE CLOSES: Tuesday, July 7, 2020 @ 5:00PM EDT