Title: Sintered Silver As Die Attach Materials
Date: 6-July-2021 (Tue)
Time: 10.00am – 11.00am (Maylasia)
Platform: IEEE CISCO WebEx
Speaker: Dr. Siow Kim Shyong
· Senior Member IEEE, CEng (IOM3), MIMMM, PMP, MATRIZ Lvl3,
· Research Fellow / Senior Lecturer, Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia
· IEEE CPMT Malaysia Chairperson from Y2014-2016
Moderator: Chua SK, Infineon
Registration: Coming soon!!!!
Please check out our website for registration details
This talk introduces the motivation for using sintered silver (Ag) as die-attach material and associated processes used in forming this Ag joint in bonding application. In addition, the talk also addresses the main factors influencing the mechanical properties (die shear strength) of the Ag joint, namely, sintering temperature, pressure, time, heating rate, atmosphere, substrate metallization and its roughness, and die-size. Comparison with sintered Cu is also included in this talk. This talk is expected to be useful to those new to this die attach materials and interested to explore this bonding technique further in their process.