ECTC 2021 Best Papers Available on Open Access

For a limited time, the Best Papers from ECTC 2021 will be available as Open Access

1)      Best Session Paper
  Proof of Concept: Glass-Membrane Based Differential Pressure Sensor
Anatoly Glukhovskoy - Leibniz University, Maren S. Prediger - Leibniz University, Jennifer Schäfer- Leibniz University, Norbert Ambrosius - LPKF Laser & Electronics AG, Aaron Vogt - LPKF Laser & Electronics AG, Rafael Santos - LPKF Laser & Electronics AG, Roman Ostholt - LPKF Laser & Electronics AG, and Marc Christopher Wurz - Leibniz University

2)      Best Interactive Presentation Paper 
  System in package embedding III-V chips by fan-out wafer-level packaging for RF applications
Arnaud Garnier, Laetitia Castagné, Florent Gréco, Thomas Guillemet, Laurent Maréchal, Mehdy Neffati, Rémi Franiatte, Perceval Coudrain, Stéphane Piotrowicz, and Gilles Simon - CEA-Leti. Authors 1-3, 7, 8, 10: CEA-Leti, Author 4: Thales DMS, Authros 5, 6: United Monolithic
Arnaud Garnier - CEA-Leti, Laetitia Castagné - CEA-Leti, Florent Gréco - CEA-Leti, Thomas Guillemet - Thales DMS, Laurent Maréchal - United Monolithic Semiconductors, Mehdy Neffati - United Monolithic Semiconductors, Rémi Franiatte - CEA-Leti, Perceval Coudrain - CEA-Leti, Stéphane Piotrowicz - III-V Lab, Gilles Simon - CEA-Leti

3)      Outstanding Session Paper
 Ultra-Thinning of 20 nm-Node DRAMs down to 3 um for Wafer-on-Wafer (WOW) Applications
Zhiwen Chen - Tokyo Institute of Technology, Naoko Araki - Tokyo Institute of Technology, Youngsuk Kim - Tokyo Institute of Technology, Tadashi Fukuda - Tokyo Institute of Technology, Koji Sakui - Tokyo Institute of Technology, Tomoji Nakamura - Tokyo Institute of Technology, Tatsuji Kobayashi - Micron Memory Japan, Takashi Obara - Micron Memory Japan, and Takayuki Ohba - Tokyo Institute of Technology 

4)      Outstanding Interactive Presentation Paper 
  Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures
T. Bernhard, S. Dieter, R. Massey, S. Kempa, E. Steinhäuser, F. Brüning. All authors: Atotech Deutschland GmbH.

5)      Intel Best Student Session Paper
  Mechanical Behavior and Reliability of SAC+Bi Lead Free Solders with Various Levels of Bismuth
KM Rafidh Hassan, Jing Wu, Mohammad S. Alam, Jeffrey Suhling, and Pradeep Lall. All authors: Auburn University