Universal Chiplet Interconnect Express (UCIe)®: An open standard for developing a successful chiplet ecosystem


Universal Chiplet Interconnect Express (UCIe)® [1] is an open industry standard interconnect, offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets. It addresses the compute, memory, storage, and connectivity needs across the entire compute continuum, spanning cloud, edge, enterprise, 5G, automotive, high-performance computing, and hand-held segments. UCIe offers a plug-and-play interconnect at the package level, enabling a designer to package chiplets from different sources, including different fabs, using a wide range of packaging technologies. 

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