A Moore's Law for Packaging
Date and Time: March 27, 2018 11:00 AM EST
Presenter: Subramanian Iyer
Host: Alan Huffman
While Silicon has scaled aggressively by over a factor of a few thousand over the last six decades the progress in packaging has been more modest – a linear factor 4-5 in most cases. In this talk, we will examine the reasons for this lag and what we are doing to fix this imbalance. Packaging is undergoing a renaissance where chip-to-chip interconnects can approach the densities of on-chip interconnects. We will discuss the technologies that are making this happen and how these can change our thinking on architecture and future manufacturing. Specifically, we will discuss two embodiments: Silicon as the next generation packaging substrate, and Flexible electronics using fan-out wafer level processing. Finally, we’ll discuss how these developments can help put some intelligence into Artificial Intelligence and bring about changes in Medical Engineering.
In support of the IEEE Heterogenous Integration Roadmap, Jason Marsh, Director of Technology at NextFlex, recently spoke on behalf of the NextFlex community led by Mark Poliks of Binghamton University and Nancy Stoffel of GE Global Research. NextFlex was pleased to participate given the broad industry support for roadmap activities, and noted that support for the Medical, Health and Wearables TWG has increased significantly. Roadmapping is core to NextFlex’s DNA, having ramped up multiple roadmapping activities over the past two years. Establishing a roadmap that is shared by industry leaders to help guide investment and development to advance manufacturing capabilities to extend beyond Moore’s law is critical to the development of wearable and implantable medical devices, as well as for delivering on the promise of the Internet of Things.
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
The 2018 ECTC includes:
· 41 technical sessions covering all aspects of advanced packaging:
o 36 technical sessions covering wafer-level and fan-out packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies
o 4 Interactive Presentation sessions
o 1 Student Interactive Presentation session
· 18 CEU-approved Professional Development Courses
· More than 100 Technology Corner Exhibits featuring industry-leading vendors
ITherm is co-locating with ECTC this year. ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.
Saratoga Springs, NY USA
Apr 30, 2018 - May 3, 2018
May 16, 2018 - May 20, 2018
May 22, 2018 - May 25, 2018
May 22, 2018 - May 25, 2018
College Park, MD USA
Jun 25, 2018 - Jun 27, 2018
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IEEE Nanotechnology Council’s NMDC 2018 conference will bring together key researchers from every sector in the nanotechnology research field, with a special focus on Materials and Devices. NMDC 2018 will be held October 14-17 in Portland, Oregon USA at the .
Conference papers will be published in IEEE Xplore. Best paper awards will be given in several categories at the conference banquet. Authors of selected papers will be invited to submit their extended article version to: IEEE Transactions on Nanotechnology, and IEEE Nanotechnology Magazine.
NMDC 2018 is soliciting on Materials and Devices for heterogeneous Nanoscience and Nanotechnology systems.