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A Moore's Law for Packaging

Date and Time:  March 27, 2018 11:00 AM EST

Presenter: Subramanian Iyer

Host: Alan Huffman

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While Silicon has scaled aggressively by over a factor of a few thousand over the last six decades the progress in packaging has been more modest – a linear factor 4-5 in most cases. In this talk, we will examine the reasons for this lag and what we are doing to fix this imbalance.  Packaging is undergoing a renaissance where chip-to-chip interconnects can approach the densities of on-chip interconnects. We will discuss the technologies that are making this happen and how these can change our thinking on architecture and future manufacturing. Specifically, we will discuss two embodiments: Silicon as the next generation packaging substrate, and Flexible electronics using fan-out wafer level processing. Finally, we’ll discuss how these developments can help put some intelligence into Artificial Intelligence and bring about changes in Medical Engineering.


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In support of the IEEE Heterogenous Integration Roadmap, Jason Marsh, Director of Technology at NextFlex, recently spoke on behalf of the NextFlex community led by Mark Poliks of Binghamton University and Nancy Stoffel of GE Global Research. NextFlex was pleased to participate given the broad industry support for roadmap activities, and noted that support for the Medical, Health and Wearables TWG has increased significantly. Roadmapping is core to NextFlex’s DNA, having ramped up multiple roadmapping activities over the past two years. Establishing a roadmap that is shared by industry leaders to help guide investment and development to advance manufacturing capabilities to extend beyond Moore’s law is critical to the development of wearable and implantable medical devices, as well as for delivering on the promise of the Internet of Things.

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As an IEEE EPS member, you have access to several benefits that we provide exclusively for our society members, including:


·  Free Subscription to IEEE DataPort (https://ieee-dataport.org): IEEE DataPort is a new data repository developed by IEEE which enables you to store your datasets (up to 2TB each) and access datasets deposited by others to support your research efforts.  IEEE DataPort will automatically provide a DOI (Digital Object Identifier) for your dataset to ensure your dataset can be referenced in articles and easily located.  Simply login to IEEE DataPort using your IEEE credentials and, as a society member, you will automatically receive the FREE subscription to IEEE DataPort which will be effective through 2019.   


The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. 

The 2018 ECTC includes:

· 41 technical sessions covering all aspects of advanced packaging: 

o 36 technical sessions covering wafer-level and fan-out packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies 

o 4 Interactive Presentation sessions 

o 1 Student Interactive Presentation session 

· 18 CEU-approved Professional Development Courses   

· More than 100 Technology Corner Exhibits featuring industry-leading vendors 


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ITherm is co-locating with ECTC this year.  ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.  

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Most accessed documents for the month of February 2018

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 

Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Sung Yun Jun ; Benito Sanz-Izquierdo ; Edward A. Parker ; David Bird ; Alan McClelland

Publication Year: 2017, Page(s):1891 - 1898

Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Benjamin Goettel ; Wolfgang Winkler ; Akanksha Bhutani ; Florian Boes ; Mario Pauli ; Thomas Zwick

Publication Year: 2018, Page(s):73 - 81


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IEEE Nanotechnology Council’s NMDC 2018 conference will bring together key researchers from every sector in the nanotechnology research field, with a special focus on Materials and Devices. NMDC 2018 will be held October 14-17 in Portland, Oregon USA at the Embassy Suites Portland Downtown hotel.

Conference papers will be published in IEEE Xplore. Best paper awards will be given in several categories at the conference banquet. Authors of selected papers will be invited to submit their extended article version to: IEEE Transactions on Nanotechnology, and IEEE Nanotechnology Magazine.


NMDC 2018 is soliciting papers and sessions on Materials and Devices for heterogeneous Nanoscience and Nanotechnology systems.

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European Microelectronics and Packaging Conference

September 16 - 19, 2019   Pisa, Italy



At the November 2017 EPS Board of Governors meeting the position of President Elect was approved.The President Elect shall support the Society and presiding President’s goals and develop strategic plans to implement during his or her Presidency.

Note that in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 1.B and in accordance with the IEEE Electronics Packaging Society Constitution, Article X, Section 2.C: Once approved by the IEEE Vice President, Technical Activities, the proposed amendment shall be publicized to the membership with notice that it goes into effect unless 40 or more Society members object in writing within 30 days. Please use this communication as notification.