The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
The 2018 ECTC includes:
· 41 technical sessions covering all aspects of advanced packaging:
o 36 technical sessions covering wafer-level and fan-out packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies
o 4 Interactive Presentation sessions
o 1 Student Interactive Presentation session
· 18 CEU-approved Professional Development Courses
· More than 100 Technology Corner Exhibits featuring industry-leading vendors
ITherm is co-locating with ECTC this year. ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.