The IEEE Transactions on Components, Packaging and Manufacturing Technology now has a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment. The intent of the Letters section is to enable the rapid dissemination of the latest information in topics of interest to the readership of the IEEE Transactions on Components, Packaging and Manufacturing Technology and thus improve dialog across the community.
The technical content of papers must be both new and signiﬁcant.
The standard length for an accepted Letters manuscript must not exceed 4 pages. in order to accommodate a comprehensive reference list of pre-published and to-be-published articles with full authors’ names, title, and (where available).
When submitting your Letters into ScholarOne, select "Letters" as paper type.