The symposium was a success, attracting more than 190 registrants. The EPS Santa Clara Valley Chapter and SEMI sponsored the symposium. The IEEE Electronics Packaging Society, IEEE Photonics Society, IEEE Electron Devices Society, SEMI and ASME/EPPD sponsor the Heterogeneous Integration Roadmap. The symposium featured talks from the various Technical Working groups as well as a plenary talk from Dr Babak Sabi, Corporate Vice President, Intel). Invited speakers included Ajit Manocha, SEMI CEO, Rolf Aschenbrenner, Fraunhofer and Dr. Nicky Lu, Chairman & CEO of Etron Technology, Inc. and Managing Board Director, Taiwan Semiconductor Industry Association (TSIA).
There was representation from industry, Academia, Government and Research Institutes.
The list of some of the institutions represented included Google, Microsoft, IBM, Cisco, Western Digital, Ford, Microsoft, Apple, Corning, Lockheed Martin, Boeing, Intel, AMD, Xilinx, NVIDIA, Broadcom, TI, Wolfspeed, TSMC, GLOBALFOUNDRIES, Samsung Electronics (Device), MicroSemi, Tower Jazz, Analog Devices, Rambus, ASE Group, JCET, Flex, Promex, Sypnosys, Cadence, Mentor Graphics, Dow Dupont, Namics, Heraeus, Advantest, Teradyne, Fraunhofer (Germany), ITRI (Taiwan), PARC, NASA Ames, iNEMI, UC Santa Barbara, Arizona State, U Santa Clara, and Binghamton University.
On February 22, the Heterogeneous Integration Roadmap held a Technical Working Group caucus for roadmap members and anyone who was interested to collaborate, network and exchange ideas. The Technical Working Groups expect to release the first version of the Roadmap by early May.