Most Popular T-CPMT Articles
Most Popular Articles according to Xplore® usage statistics
Muneeb Zia ; Bryce Chung ; Samuel Sober ; Muhannad S. Bakir
Publication Year: 2020, Page(s): 197 – 202
Process Modules for High-Density Interconnects in Panel-Level Packaging
Friedrich-Leonhard Schein ; Ruben Kahle ; Marc Kunz ; Tim Kunz ; Jordan Kossev ; Tobias Müller ; Mathias Pentz ; Michael Dietterle ; Andreas Ostmann
Publication Year: 2020, Page(s): 5 - 10
3-D Printed Metal-Pipe Rectangular Waveguides
Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn
Publication Year: 2015, Page(s): 1339 - 1349
Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
Beomjin Kwon ; Thomas Foulkes ; Tianyu Yang ; Nenad Miljkovic ; William P. King
Publication Year: 2020, Page(s): 220 - 229
Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
Publication Year: 2019, Page(s): 1952 - 1962