Most Popular T-CPMT Articles

Most Popular Articles according to Xplore® usage statistics

Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording

Muneeb Zia Bryce Chung Samuel Sober Muhannad S. Bakir

Publication Year: 2020, Page(s): 197 – 202

Process Modules for High-Density Interconnects in Panel-Level Packaging

Friedrich-Leonhard Schein ; Ruben Kahle ; Marc Kunz ; Tim Kunz ; Jordan Kossev ; Tobias Müller ; Mathias Pentz ; Michael Dietterle ; Andreas Ostmann

Publication Year: 2020, Page(s): 5 - 10

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s): 1339 - 1349

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Beomjin Kwon ; Thomas Foulkes ; Tianyu Yang ; Nenad Miljkovic ; William P. King

Publication Year: 2020, Page(s): 220 - 229

Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect

Ravi Mahajan Zhiguo Qian Ram S. Viswanath Sriram Srinivasan Kemal Aygün Wei-Lun Jen Sujit Sharan Ashish Dhall

Publication Year: 2019, Page(s): 1952 - 1962 

 

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