Upcoming Webinars from the Silicon Valley EPS Chapter

We invite technologists from around the world to visit the SCV Chapter’s website (www.ieee.org/scveps) and sign up for the webinars that interest you:

Additively-Printed Multilayer Flexible Substrates with Z-axis Interconnects (Pradeep Lall) — aerosol-jet, inkjet, direct-write, screen print, multi-layer, process factors, performance

March 18, 2021 at 12:00 pm PDT/3:00 pm EDT

Sustainable Electronics – From Dumped e-Waste to a Circular Economy: What is Needed?(Mervi Kröckel) — legislation, EU targets, recycling steps, applied ecodesign, carbon neutrality, case studies …

April 15, 2021 at 12:00 pm PDT/3:00 pm EDT

Packaging and Interconnect Technologies for Cryogenic and Quantum Systems(Michael Hamilton) — thin-film, multi-conductor, flexible, superconducting cables, low insertion loss …

April 22, 2021at 12:00 pm PDT/3:00 pm EDT

Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications(Zia Karim) — faster cure, lower temperatures, vacuum, thermal stability, properties …

May 6, 2021 at 12:00 pm PDT/3:00 pm EDT

You can join the EPS SCV Chapter email list from their home page

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