ECTC 2022 Special Session: Interconnect Technologies for Chiplets

For 50 years, the number of transistors that could be squeezed onto a piece of silicon had increased on a predictable schedule known as Moore’s law. However, the Moore’s law is reaching to the end. The new approach comes with “chiplets” which is something like high-tech Lego blocks. Instead of carving new processors from silicon as single chips, semiconductor companies assemble them from multiple smaller pieces of silicon—known as chiplets. We will discuss the several interconnect technologies for Chiplets such as Silicon Bridge, Advanced Interposer, Fan-out wafer-level packaging, and optical interconnection. We will have 6 panelists and each panelist will prepare a short set of slides to present within 10-15 minutes, followed by panel discussion. The Special Seminar will be on June 2, 2022 at 8:00pm – 9:30pm. 

ECTC is open for registration at ECTC | IEEE Electronic Components and Technology Conference.   

Please click here for details on the panel.