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ECTC 2022 Best Papers will be available until June 1, 2023.

1) Best Session Paper
  Advanced Fan-Out Packaging Technology for Hybrid Substrate Integration
 Lihong Cao, Teck Chong Lee; Rick Chen; Yung-Shun Chang; Hsingfu Lu; Nicholas Chao; Yen- Liang Huang; Chen-Chao Wang; Chih-Yi Huang — ASE Group

2) Best Interactive Presentation Paper 
  Novel Zero Side-Etch Process for <1μm Package Redistribution Layers
Pratik Nimbalkar, Pragna Bhaskar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, and Rao Tummala — Georgia Institute of Technology

3) Outstanding Session Paper
  Organic Interposer CoWoS-R+ (plus) Technology
M. L. Lin, M. S. Liu, H. W. Chen, S. M. Chen, M. C. Yew, C. S. Chen, and Shin-Puu Jeng — Taiwan Semiconductor Manufacturing Company

4) Outstanding Interactive Presentation Paper 
  Scalable through Mold Interconnection Realization for Advanced Fan Out Wafer Level Packaging Applications
Aurélia Plihon, Edouard Déschaseaux, Rémi Franiatte, Jérome Dechamp, Simon Vaudaine, Jennifer Guillaume, Catherine Brunet-Manquat, Stéphane Moreau, and Perceval Coudrain — CEA-LETI

5) Intel Best Student Session Paper
  Co-Design of Thermal Management with System Architecture and Power Management for 3D Ics.
Rishav Roy, Purdue University — School of Mechanical Engineering (G077); co-authors: Shidhartha Das, Benoit Labbe, Rahul Mathur, Supreet Jeloka — ARM,Inc.

The EPS proudly congratulates the lastest recipient of the IEEE Certificatate of Achievement

Dr. Kaustubh Basu

Name: Chiplet Design and Heterogeneous Integration Packaging

Date:  April 20, 2023

Time: 3:30 pm - 6:30 pm - All times are (UTC+01:00) Bern

Location: ETH Zurich, Gloriastrasse 35, Rm E-81, Zurich, Switzerland 

Speaker:  John H. Lau, Unimicron Technology Corporation

Bio: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging has published more than 518 peer-reviewed papers (377 are the principal investigator), 42 issued and pending US patents (27 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.

For more details and to register

The 25th IEEE Electronics Packaging Technology Conference (EPTC2023) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. EPTC2023 will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities.

The EPTC technical program committee, with more than 100 experts from diverse semiconductor packaging technology areas, is committed to creating an engaging technical program for the international packaging community. The technical program will be supplemented by an exhibition, which provides an opportunity for leading companies to exhibit their latest technologies and products. Last year there were 430 attendees. This year being our 25th Anniversary, we have a special 4-day program and expect more attendees. 

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 Luu Nguyen

Co-Chair IEEE Quantum

Steering Committee of QCE23

IEEE Quantum Week (IEEE International Conference on Quantum Computing and Engineering (QCE)) is the flagship conference of the IEEE Quantum Initiative.  It bridges the gap between the science of quantum computing and its ecosystem.  It is a multidisciplinary venue that offers attendees the unique opportunity to discuss challenges and opportunities with quantum scientists, engineers, programmers, educators, and entrepreneurs. 

EPS has been one of the ten co-sponsoring IEEE Societies.

QCE22 was held as a hybrid event in Broomfield, CO, on Sept. 18-22, 2022.  It attracted over 1,050 attendees (68% in-person, 32% virtual).  Over 250 hours of quantum were recorded comprising of 9 keynotes, 25 tutorials, 16 workshops, 13 panels, 67 technical papers, 59 posters, and 5 Birds-of-a-Feather sessions.  Over 40 exhibits featured technologies from quantum companies, start-ups, and research labs.  Quantum Week workshops have spawned twenty separate communities over the past three years.

QCE23 will also be a hybrid event, held in Bellevue, WA, on Sept. 17-22, 2023.  After three successful IEEE Quantum Week events, we’re looking forward to developing an outstanding program to showcase quantum research, applications, education, and training. 

For more information on the conference and participation details, check:  https://bit.ly/qce23-contribute.

Call for Contributions information

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, EDAPS 2023 will be held in the paradise island of Mauritius, December 12-14, 2023. For further information, please visit the website at edaps.org

Papers should be submitted electronically in two-column and three-page PDF file format through the EDAPS website (www.edaps.org). A Microsoft Word template is available on the symposium website. Hardcopy submissions will NOT be accepted. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Non-compliant manuscripts will not be considered for review. Submission deadline is August 12, 2023.

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Luu Nguyen


Member – IEEE Future Directions Committee

Co-Chair IEEE Quantum

The IEEE Future Directions Committee (FDC) was established to anticipate and determine the direction of new and emerging technologies, spearhead their investigation and development by IEEE, and drive them to maturity within the IEEE infrastructure.  FDC also serves as a liaison to foster collaboration among the different Societies and Councils.

As a new member of FDC, I would like to point out two new Initiatives that have a large packaging aspect.  Collaboration between the EPS community and these Initiatives would be mutually beneficial:  conference participation, webinars, panels, exchanging of speakers, and roadmap contributions.

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Michael Hamilton (*) and Luu Nguyen (**)

(*) Auburn University; Director, Alabama Micro/Nano Science and Technology Center

(**) PsiQuantum; Co-Chair, IEEE Quantum

Quantum information processing (QIP) can be performed using any multi-state quantum system that is sufficiently isolated from its surrounding thermal and dissipative environment while also being sufficiently controllable and addressable. These systems function as quantum bits (qubits) and quantum-limited sensors that are used for information-processing tasks such as computing and sensing. Leveraging the incredible technology and related infrastructure developed for integrated solid-state systems, such as CMOS, is expected to yield efficient routes to realize densely integrated QIP systems with many more qubits, which is much more computationally powerful than demonstrated systems (with qubit numbers of order 100).

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Govindarajan Muralidharan and Ercan Cakmak

Oak Ridge National Laboratory Oak Ridge, TN, USA

muralidhargn@ornl.gov, cakmake@ornl.gov



With the advent of wide band-gap devices which can operate at higher temperatures than Si-based devices, there is interest in the evaluation of Au-based solders or alternate materials for use as die-attach materials. In this study, X-ray radiography and X-ray tomography were used to characterize the evolution of defects due to thermal cycling in Au-based materials used as a die-attach and in brazed joints. Evolution of voids and cracks as a function of thermal cycling was clearly observed using these techniques, highlighting their potential role in understanding joint behavior at high temperatures and after thermal or power cycling.

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Goran Miskovic (IEEE Senior Member) and Robin Kaufhold

Silicon Austria Labs, Europastraße 12, Villach, Austria

 E-Mail: goran.miskovic@silicon-austria.com, robin.kaufhold@silicon-austria.com


Regardless of the technology, additive or subtractive, the miniaturization trend is constantly pushing for smaller resolutions. The rise of global challenges in material availability, fabrication in three dimensions (3D), design flexibility and rapid prototyping have pushed additive manufacturing (AM) into the spotlight. Addressing the miniaturization trend, AM has already successfully answered the challenges for microscale 3D fabrication. However, fabricating with nano resolution still presents a challenge. In this review, we will present some of the most reported AM-based technologies capable of nanoscale 3D fabrication addressing resolutions of ≤ 500 nm. The focus is placed on Electrohydrodynamic (EHD) printing (also known as e-jet printing), as EHD printing seems to have the best trade-off when it comes to technique complexity, achievable resolutions, material diversity and potential to scale-up throughput. An overview of the smallest achieved resolutions as well as the most unique use cases and demonstrated applications will be addressed in this work.

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