Upcoming Event - SWISS IEEE EPS AND SSCS LECTURE
Name: Chiplet Design and Heterogeneous Integration Packaging
Date: April 20, 2023
Time: 3:30 pm - 6:30 pm - All times are (UTC+01:00) Bern
Location: ETH Zurich, Gloriastrasse 35, Rm E-81, Zurich, Switzerland
Speaker: John H. Lau, Unimicron Technology Corporation
Bio: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging has published more than 518 peer-reviewed papers (377 are the principal investigator), 42 issued and pending US patents (27 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
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