ECTC 2022 Best Papers Available as Open Access

ECTC 2022 Best Papers will be available until June 1, 2023.

1) Best Session Paper
  Advanced Fan-Out Packaging Technology for Hybrid Substrate Integration
 Lihong Cao, Teck Chong Lee; Rick Chen; Yung-Shun Chang; Hsingfu Lu; Nicholas Chao; Yen- Liang Huang; Chen-Chao Wang; Chih-Yi Huang — ASE Group

2) Best Interactive Presentation Paper 
  Novel Zero Side-Etch Process for <1μm Package Redistribution Layers
  Pratik Nimbalkar, Pragna Bhaskar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, and Rao Tummala — Georgia Institute of Technology

3) Outstanding Session Paper
  Organic Interposer CoWoS-R+ (plus) Technology
  M. L. Lin, M. S. Liu, H. W. Chen, S. M. Chen, M. C. Yew, C. S. Chen, and Shin-Puu Jeng — Taiwan Semiconductor Manufacturing Company

4) Outstanding Interactive Presentation Paper 
  Scalable through Mold Interconnection Realization for Advanced Fan Out Wafer Level Packaging Applications
  Aurélia Plihon, Edouard Déschaseaux, Rémi Franiatte, Jérome Dechamp, Simon Vaudaine, Jennifer Guillaume, Catherine Brunet-Manquat, Stéphane Moreau, and Perceval Coudrain — CEA-LETI

5) Intel Best Student Session Paper
  Co-Design of Thermal Management with System Architecture and Power Management for 3D Ics.
  Rishav Roy, Purdue University — School of Mechanical Engineering (G077); co-authors: Shidhartha Das, Benoit Labbe, Rahul Mathur, Supreet Jeloka — ARM,Inc.