X-Ray Radiography Study of The Evolution of Defects in Solder Joints*

Govindarajan Muralidharan and Ercan Cakmak

Oak Ridge National Laboratory Oak Ridge, TN, USA

muralidhargn@ornl.gov, cakmake@ornl.gov

 

Abstract

With the advent of wide band-gap devices which can operate at higher temperatures than Si-based devices, there is interest in the evaluation of Au-based solders or alternate materials for use as die-attach materials. In this study, X-ray radiography and X-ray tomography were used to characterize the evolution of defects due to thermal cycling in Au-based materials used as a die-attach and in brazed joints. Evolution of voids and cracks as a function of thermal cycling was clearly observed using these techniques, highlighting their potential role in understanding joint behavior at high temperatures and after thermal or power cycling.

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