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The EPS Board of Governors (BoG) includes 18 Members-at-Large, elected by the full voting membership of the Society. The three-year terms of the Members-at-Large are staggered -- so that six Members-at-Large to the Board of Governors are elected annually.

Members-at-Large are elected to achieve totals proportionate to the geographic distribution of EPS members. Any IEEE Region/grouping of Regions determined to have at least 10% of total EPS members will have the proportional number of Member-at-Large positions designated to it for representation on the BoG.  The slate of candidates for each year’s election will be constructed to ensure that the resulting total of newly elected Members-at-Large plus continuing Members-at-Large has the proper proportion of representatives from each Region/grouping of Regions.

Nomination Deadline: June 30, 2019

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Please Submit Nominations online

Date: Tuesday May 28, 2019

Location: The Cosmopolitan, Las Vegas NV

Time: 8:00 a.m. - 5:30 p.m

Room: Condesa 3

A Heterogeneous Integration Roadmap workshop, an initiative sponsored by the IEEE EPS, EDS and Photonics Societies and also SEMI and ASME EPPD, will be held on Tuesday, May 28th, from 8:00 a.m. to 5:30 p.m. in conjunction with ECTC and ITherm. This workshop is open to all conference attendees and there is no fee for attendance. Registration is not necessary. So, plan on attending this workshop, if you are keen on learning and contributing to the future directions of heterogeneous integration technologies, serving system integration for future markets and products.

From April 1 - June 1, 2019, the Best Paper winners from ECTC 2018 will be available to everyone!

1) Best Session Paper
Boettge, Bianca, F. Naumann, S. Behrendt, M. G. Scheibel, S. Kaessner, S. Klengel, M. Petzold et al. "Material characterization of advanced cement-based encapsulation systems for efficient power electronics with increased power density 
2) Best Interactive Presentation Paper
Ostrowicki, Gregory, Siva Gurrum, and Amit Nangia. "Correlated Model for Wafer Warpage Prediction of Arbitrarily Patterned Films.

3) Outstanding Session Paper
Del Carro, Luca, Martin Kossatz, Lucas Schnackenberg, Matthias Fettke, Ian Clark, and Thomas Brunschwiler. "Laser Sintering of Dip-Based All-Copper Interconnects." 

4) Outstanding Interactive Presentation Paper
Brand, Sebastian, Bianca Böttge, Michael Kögel, Falk Naumann, Jurrian Zijl, Sebastiaan Kersjes, Thomas Behrens, and Frank Altmann. "Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves." 


The next EPS Board of Governors (BoG) meeting will be held June 1, 2019 in conjunction with ECTC and ITherm.

All Members are welcome to attend. The Board members will be discussing, among other things, the strategic direction of the Society as well as the latest projects and events the Society is working on. 

Date: Saturday June 1, 2019

Time: 9:00 AM - 6:00 PM 

Location: The Cosmopolitan, Las Vegas, NV

Room: Condesa 5 & 6

Headed by eminent Keynotes, the Programme comprising 29 Technical Sessions is a must for engineers and scientists to keep at the forefront of technology. Excellent Papers accepted by eminent international referees are scheduled to be presented in the Conference Sessions comprising: Advanced Packaging, Applications, Embedded Electronics & Smart Textiles, Green Electronics, Interconnection Technologies, Manufacturing Technologies, MEMS, Modelling, Nano Technologies, Power & Thermal Management, Reliability & Quality, Substrate Technologies.

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IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct. 23th-25th at Taipei Nangang Exhibition Center. For grasping the latest trend, the symposium highlights the theme “IMPACT-IAAC on 5G-Evolution & Revolution.” The emergence of the fifth generation of mobile communications with its emphasis on massive MIMO and channel bandwidths over 1 GHz at mmWave frequencies is set to change everything we used to know about the design, validation and operation of cellular systems.

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IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE EPS and has been held annually in Kyoto in November. The conference originally started
in 1992 as “The VLSI Packaging Workshop in Japan” and was re-named to “ICSJ” in 2010. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.


November 18 – 20, 2019,

Kyoto Univ. Clock Tower Centennial Hall, Kyoto, JAPAN


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The 21st Electronics Packaging Technology Conference (EPTC 2019) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2019 will feature keynotes, technical sessions, short courses, forums, an exhibition, social and networking activities. It aims to provide a good coverage of technology developments in all areas of electronics packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet with leading international experts. 

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Access the Most Polpular Transactions on Components, Packaging and Manufacturing Technology based on Xplore usage statistics here