Fundamentals of Device and System Packaging: Technologies and Applications

Prof. Tummala of Georgia Tech publishes the most comprehensive and up–to-date Undergrad and Introductory packaging textbook, with all the Latest Device and Systems Packaging Technologies. 

Undergrad and  introductory Textbook- "Fundamentals of Device and System Packaging: Technologies and Applications” edited by Prof Tummala, published and available from Amazon and McGraw-Hill. 

For decades, Moore's Law has driven the semiconductor technology advancements.  As Moore’s Law for IC’s comes to an end due to physical, material, electrical and financial limitations, this book goes on to propose Moore’s Law for Packaging through advanced interconnections at IC and system levels. In the first chapter Prof. Tummala explains the device packaging concept and its evolution from microelectronics to  RF and wireless,  followed by photonics and MEMS and Sensors  eventually leading to quantum devices. He describes the shift in industry focus from transistors to interconnections at the system level enabled by heterogeneous integration in 2D, 2.1D, 2.5D and 3D packages. 

Prof. Tummala introduces the concept of Moore’s Law for Packaging or interconnections (MLP) that cab be viewed as interconnecting and integrating smaller chips with the highest transistor density and highest performance at the lowest cost. Just as Moore’s Law for ICs has two components -- the number of transistors and cost of each transistor -- Moore’s Law for Packaging is  proposes to have  two components as well: the number of interconnections or I/Os and the cost of each I/O. This book lays the groundwork for all the elements required to extend Moore’s Law to packaging, not only at device level but. At system level.  

This book introduces 16 essential core packaging technologies at system level. Each technology is detailed in its own chapter.  These include electrical, mechanical, and thermal design, materials and processes for electronic, photonic, wireless to 5G and to millimeter-wave, I/O interconnections and assembly to organic, Si and wafer-level packages, passive components, sealing and encapsulation, and board design and assembly.  Once these 16 building block technologies are explained, the book moves on to application of these  packaging technologies  and architectures  for autonomous driving, bioelectronics, communication systems, computer systems, flexible electronics and smartphones – dedicating a chapter to each of these applications. Nowhere else can one find a more comprehensive explanation of the fundamentals and applications of electronics packaging described in a single volume. The homework problems and recommended reading at the end of each chapter are other attributes of the book. It is the ideal undergraduate and introductory  textbook to prepare future packaging engineers, or  anyone interested in a deeper understanding of the  packaging technology. 

The book was authored and edited by Prof Rao  Tummala ,with contributions from  57 of the world’s leading experts from Intel, IBM, TI, Global Foundries, Sanmina, and many others, as well as Prof Tummala’s colleagues at Georgia Tech., UCLA, KAIST(Korea), Michigan State, Chinese Academy of Sciences, TU Dresden  and his students at Georgia Tech.

Author: Eric Perfecto