EPS Reliability Technical Committee
The reliability TC meet every quarter on Webex and a face to face meeting every year at ECTC conference. The following are the major missions and visions of the reliability TC.
Identify the current reliability challenges
Advanced packaging technologies
Advanced materials/interconnects
Advanced packaging assembly processes
Package board and advanced Si BEOL/FEOL interactions
Develop the reliability roadmap on emerging technologies/devices/materials in 5 and 10 years
IC Component and System - with the HIR (Heterogeneous Integration Roadmap) Task Groups
Si – with IRDS TWGs
SiC/GaN/GaAs/InP - with Wide Bandgap Roadmap; Ask for expert in SiC/GaN; EPOSS in Europe
Organize seminars/workshop and work with the major conferences to cover the challenging reliability issues
ECTC/IRPS/EPTC/ESTC/ICEPT/ASME Interpack/EurosimE/Itherm
The following PDCs have been conducted at EPTC
· EPTC2018, Advanced Integrated Circuit Design for Reliability, Dr. Richard Rao
· EPTC2019, Reliability Mechanics and Modeling for IC Packaging - Theory, Implementation and Practices, Prof. Xuejun Fan, Lamar University
The committee has identified the following challenging reliability issues and will schedule webinars to address each of these topics.
Multi physics and multi scale interactions
Thermal, mechanical and electrical
Chip to package to board interaction mechanisms
Chip, package and system Reliability co-design/simulation
Advanced 2.5D/3D/2.x D IC and Si Photonics packages with new materials and multiple critical interfaces
GPU/CPU/FPGA with advanced Si/packaging to meet stringent automotive reliability targets
Si nodes beyond 5nm – new FET architecture/material/process/interface characterization
Reliability testing- With the silicon process and package process/material change dramatically, current JEDEC long term reliability standard need to be updated
If you are interested in joining the committee or want to know more information, please contact the following individuals.
Dr. Richard Rao, rrao@inphi.com, Reliability TC Chair, USA
Dr. Xueren Zhang, XUERENZ@xilinx.com, Reliability TC Co-Chair, Asia
Dr. Gromala Przemyslaw Jakub, PrzemyslawJakub.Gromala@de.bosch.com, Reliability TC Co-Chair, Europe