Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines.
The workshop content will be available on demand and is open to everyone. The purpose of the HIR workshop is to broaden the proliferation of the roadmap content to the virtual participants for dialogue and feedback for inclusion into the 2021 edition.
There will also be two live Panel Sessions: "Rising to the Chiplet Challenge" on June 2nd and "Test in Heterogeneous Integration" on June 4th. These panels are included with ECTC registration.