EPTC 2021: Call for Papers

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by IEEE Electronics Packaging Society (EPS). EPTC2021 conference will feature keynotes, technical sessions, technology talks, exhibition corners and networking activities. It aims to provide a platform to cover the technology developments in the complete spectrum of electronics packaging from design to manufacturing. Since its inauguration in 1997, EPTC has established a highly reputed electronics packaging conference in Asia and selected as an EPS flagship conference in the Asia-Pacific Region 10, covering diverse   reas of electronic packaging technology topics. These include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, Internet of things (IOT), 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration technology and, smart manufacturing.

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