The Bunch of Wires (BoW) – An Open-Source Physical Interface Enabling Chiplet Architectures

Lei Shan

Ampere Computing, Santa Clara, CA

shanlei@amperecomputing.com

Abstract

As on-chip performance scaling slows down due to semiconductor manufacturing technology and yield limitations, in-package system integration combining with the concept of “chiplet” becomes a widely adopted solution especially with the growth of system functionality and heterogeneous architectures. Accompanied with this emerging trend, various interconnect standards are being developed to meet the demands of high I/O bandwidth with low-power and low-latency, so that system performance shall not be compromised while cost is significantly reduced by “reassembling” chiplets into an equivalent gigantic monolithic silicon chip.