ICSJ 2022 Call for Papers

11th IEEE CPMT Symposium Japan (ICSJ 2022)
“Electronics Packaging meets DX”
- Heterogeneous Integration for the next Wellbeing & Sustainability

The 11th IEEE CPMT Symposium Japan (ICSJ 2022) organizing committee is seeking abstracts for the upcoming event to be held November 9 -11, 2022 in Kyoto, Japan.

Authors are invited to submit a PDF file which includes ”500-word abstract” and figures through our website
The deadline for Abstract Submissions is May 29, 2022.

ICSJ is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform for participants to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to “ICSJ” and ICSJ2022 is the 11th. ICSJ meeting, or 20th. conference since establishing VPWJ.

Even still vague situation with COVID19, following the last year, ICSJ2022 will be a hybrid event of on-site and virtual meetings where several presentation options are available for the authors to select and the details will be announced on the official website at a later date.

For more information