Electronics Packaging Technology Conference (EPTC) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region. It aims to cover the complete spectrum of electronic packaging technology and it is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts.
The 25th Electronics Packaging Technology Conference (EPTC 2023) will take place from 5th December to 8th December 2023 in Singapore. It will feature keynotes, technical sessions, invited talks, panels, workshops, exhibitions, and networking activities. Topics include modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, emerging technologies, 2.5D/3D integration technology, smart manufacturing, automation, and AI. This year marks the 25th anniversary of the EPTC history. The organizer will extend the program from a 3-day event to a 4-day event to celebrate this occasion.
Do not miss this opportunity to be part of EPTC2023! We invite you to submit your abstracts online by the deadline 31 May 2023 through https://www.eptc-ieee.net/