November 2017 - IEEE Electronics Packaging Society
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"The Origins of Silicon Valley: Early Technology and EPS Pioneers" Monday December 4, 2017 11:00 AM EST

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Presenter: Paul Wesling

Host: Ken Pyle

Abstract: 

Discover the exciting and colorful history of technology development and innovation that began in Palo Alto CA in 1910 and spread across the Santa Clara Valley.  You'll meet some of the colorful characters – Cyril Elwell, Lee De Forest, Bill Eitel, Charles Litton, Fred Terman, David Packard and others – who set leadership patterns for the electronics industries through their inventions and process development. You’ll find out about Charles “Bud” Eldon of HP, who founded a predecessor IRE Group in 1954 that become CPMT, now EPS, and served as president of the IEEE.  Find out why Silicon Valley has had such an effect on the world.  

Bio:

Paul Wesling got interested in technology as a youngster.  He went on to receive his BS in electrical engineering and his MS in materials science from Stanford University.  Following assignments at GTE/Lenkurt Electric, ISS/Sperry-Univac, Datapoint Peripheral Products (VP - Product Integrity), and Amdahl (mainframe testing), he joined Tandem Computers in Cupertino (now part of Hewlett Packard) in 1985.  He designed several multi-chip module prototypes, managed Tandem's Distinguished Lectures series, and organized a number of advanced technology courses for his Division and also for the IEEE.  He managed a grant from the National Science Foundation for the development of multimedia educational modules.  Paul retired from HP in 2001, and then served for 10 years as the Communications Director for the IEEE’s S.F. Bay Area Council.

 

As Vice President of Publications from 1985 through 2008, he supervised four archival journals and a newsletter for IEEE’s Electronics Packaging Society.  He is a Fellow of the IEEE, and received the IEEE Centennial Medal, the Board's Distinguished Service award, the Society Contribution Award, and the IEEE's Third Millennium Medal. He has organized over 500 courses for the local IEEE chapter in the Santa Clara Valley (Silicon Valley), many of them held at Stanford University (and, more recently, at Silicon Valley company facilities).

 

Get Involved in the Heterogeneous Integration Roadmap (HIR) activities - sponsored by the IEEE Electronics Packaging Society (EPS)SEMI, IEEE Electron Devices Society (EDS)IEEE Photonics Society and the ASME Electronic & Photonic Packaging Division (ASME EPPD Division)

The HIR Global Advisory Council was created to:

·         Advise HIR in defining and maintaining a long term vision of technology innovation required to support Industry progress over the next 15 years.

·         Advise HIR to ensure that its value proposition for stakeholders in industry, academia, research institutes and government is understood by and available to all.

Current members of the Global Advisory Council include:

  • Ajit Manocha
    • President and CEO of SEMI. Former CEO of GlobalFoundries and served as chair of SIA. Also served in executive roles at Philips/NXP & Spansion. 
  • Nicky Lu
    • Founder and Chairman of Etron Technology in Taiwan. Served as chair of TSIA and WSC and is a member of the US National Academy of Engineering. 
  • Babak Sabi
    • Intel Corporation Corporate Vice President, General Manager, Assembly Test Technology Development.
  • Hubert Lakner
    • Board of Directors Chairman, Fraunhofer Microelectronics Group and Founding Director of Fraunhofer Institute of Photonic Microsystems (IPMS) in Dresden.

 

For more information on how to get involved please contact the Chair William Chen or the Co Chair  Bill Bottoms of the Heterogeneous Integration Roadmap Committee (HIR IRC)

 
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Greetings to all EPS (CPMT) M’sia members. Time flies, we are approaching end of Y2017! I am happy to announce that the CPMT Society name change to “Electronics Packaging Society (EPS)” has been approved by the IEEE Board of Directors and being updated in Q3 this year! We are now asking for your help and your support to realize the intended benefits of this change, as we shall embrace together with EPS HQ: improved society branding; More inclusive and better representation of the broad focus of interest of our society and improved clarity will result in increased collaboration with other IEEE societies. This is indeed a great move with good alignment with our existing technical field of interest is covering every aspect of electronic packaging. Hence, let’s continue work according to the vision and mission that we have planned! 

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