2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)
SIITME provides an international forum for dissemination of information and scientific results relating to education, research and development activities. This conference is a premier European forum for the exchange of information between experienced scientists and academic communities within electronic industries. There is a unique combination of oral and poster presentations as well as individual meetings where researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during the three-day conference.
•SIITME 2018 was a SUCCESS!!!
•154 participants from 9 countries
•6 Keynote speakers (2 – Germany and 4 -- United States)
•IEEE members 39
•10 companies were exhibitors
•95 conference presentations
•2 workshops focused on: human resource issues and, reliability aspects on design and manufacturing electronic products