Description: This award recognizes the best "Vision of the Future of Electronics Packaging" abstract, to be presented at the IEEE Electronic Components and Technology Conference (ECTC) during the Tuesday evening panel session. The competition welcomes submissions from all IEEE Students, Graduate Students and Young Professionals*.
* A Young Professional is an IEEE member that has completed their first academic degree within the last 15 years.
Presented to: An individual or a team of not more than three.
Prize: Up to three awards will be provided to an individual or team. The prize will be $500 for each winner (if one of the winners is a team, $500 will be awarded to each member of the team). Travel grants will be provided to attend ECTC, and applied toward actual travel expenses including airfare, hotel and meals. Up to $1,000 for US based winners and up to $1,500 for Non US winners. Proof of travel expenses including receipts will need to be submitted for the reimbursements to be dispersed. Travel funding can be used for an individual or shared among the team (Total funding $1,000 per US team; Total funding $1,500 per Non US team).
Eligibility: All ECTC and ITherm attedees. Winners are required to present their packaging visions at the ECTC Tuesday evening Panel Session.
Basis for Judging: Judges will be selected members of the EPS Emerging Technology Technical Committee, the EPS VP-Technology, and the EPS President as an ex-officio member. Submissions are judged based on technical innovation, merit, originality, relevance and potential impact on the electronics packaging field. If no submissions are deemed to be of prize quality, an award will not be granted.
Presentation: The award will be presented at the EPS luncheon held during IEEE Electronic Components and Technology Conference (ECTC).
Deadline for Abstract Submission: January 31, 2019