The 2019 Heterogeneous Integration Roadmap (HIR) isstimulate pre-competitive collaboration among industry, academia and government to accelerate progress.
The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines.
"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE EP Society and has been held annually in Kyoto in November.
Electronics Packaging for AI and Beyond: Over the last several decades, the continuous development of semiconductor chips has supported the growth of computing performance. Computer systems have begun to enrich our lives, and now with the emergence of artificial intelligence (AI) systems, these systems will evolve to be even more intertwined with our lives. Our focus has now shifted to how we realize, oversee, and cooperate with the AI. At past ICSJ conferences, our focus had evolved alongside these emerging technologies where we had discussed and tried to predict the future state of the electronics packaging technologies which would lead to new computer applications.
In 2019, the conference's theme will be the contribution of electronics packaging to AI and beyond.
The ICSJ 2019 Highlights
This year, we are very honored to be supported by 17 sponsors!
Some sponsor companies are also cooperating with the conference as exhibitors.
Don’t miss the brilliant items to be exhibited at ICSJ2019 as follows:
HIR Meeting at 2019 IEEE International Electron Devices Meeting
Venue: Hilton San Francisco Union Square, 333 O’Farrell Street
Date: Sunday, December 8, 2019
Time: 5:30 – 7:00 PM
5.30 - 6.00 pm HIR update by Bill Bottoms
6:00 - 6.15 pm vacuum electronics for heterogeneous Integration
6:15 - 6:30 pm Heterogeneously Integrated Photonics by Amr Helmy
6:30 - 6: 45 pm Dielets for Heterogeneous Integration
6:45 - 7: 00 pm Open Discussion
The 21st Electronics Packaging Technology Conference (EPTC 2019) is an International event organized by the IEEE RS/EPS/EDS Singapore Chapter and sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2019 will feature keynotes, a panel session, Invited talks, technical sessions, short courses, forums, an exhibition, social and networking activities. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia-Pacific and is well attended by experts in all aspects of packaging technology from all over the world. EPTC is now the flagship conference of IEEE EPS in Region 10.
EPTC 2019 Program includes technical presentations contributed by distinguished speakers from industry, academia and research institutions. A complementary conference banquet will be held in Marina Bay Sands, the conference hotel. For easy access to the conference venue and a comfortable stay in Singapore, we have engaged with Marina Bay Sands to offer specially-discounted room prices via here
EPTC 2019 Registration details can be found here
EPTC 2019 Advance program can be found here
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. This international event brings together both academics and industry leaders to present and discuss the state-of the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.
Tel Aviv, Israel
Nov 4, 2019 - Nov 6, 2019
Nov 18, 2019 - Nov 20, 2019
Nov 25, 2019 - Nov 27, 2019
Dec 4, 2019 - Dec 6, 2019
Dec 16, 2019 - Dec 18, 2019
Publication Year: 2017, Page(s):964 – 973