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The 2019 Heterogeneous Integration Roadmap (HIR) is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration among industry, academia and government to accelerate progress.

The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines.

View and Download the 2019 HIR

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ICSJ

"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE EP Society and has been held annually in Kyoto in November.

Electronics Packaging for AI and Beyond: Over the last several decades, the continuous development of semiconductor chips has supported the growth of computing performance. Computer systems have begun to enrich our lives, and now with the emergence of artificial intelligence (AI) systems, these systems will evolve to be even more intertwined with our lives. Our focus has now shifted to how we realize, oversee, and cooperate with the AI. At past ICSJ conferences, our focus had evolved alongside these emerging technologies where we had discussed and tried to predict the future state of the electronics packaging technologies which would lead to new computer applications. 

In 2019, the conference's theme will be the contribution of electronics packaging to AI and beyond.

The ICSJ 2019 Highlights

Exhibition

This year, we are very honored to be supported by 17 sponsors!

Some sponsor companies are also cooperating with the conference as exhibitors. 

Don’t miss the brilliant items to be exhibited at ICSJ2019 as follows:

-       Micro dispenser: Liquid precision control technology, by Musashi Engineering

-       Micro Probe Station enabling In-situ measurement, by Nextron

-       High-speed 28/56G connect solution & Submersible AOC, by Samtec

-       Aqua Plasma Cleaner for advanced packaging, by Samco

-       Solution for IC Packaging, by Fujitsu

-       i-THOP, Wireless Sensor Module, POL, and Optical substrate, by Shinko

-       Next-Generation Co-Package Solution Centera

Plenary & Invited talks

Advance Program

 

Register Today!

 

HIR Meeting at 2019 IEEE International Electron Devices Meeting

Venue: Hilton San Francisco Union Square, 333 O’Farrell Street

Date: Sunday, December 8, 2019

Time: 5:30 – 7:00 PM

5.30 - 6.00 pm HIR update by Bill Bottoms

6:00 - 6.15 pm vacuum electronics for heterogeneous Integration

6:15 - 6:30 pm Heterogeneously Integrated Photonics by Amr Helmy

6:30 - 6: 45 pm Dielets for Heterogeneous Integration

6:45 - 7: 00 pm Open Discussion

EPTC

The 21st Electronics Packaging Technology Conference (EPTC 2019) is an International event organized by the IEEE RS/EPS/EDS Singapore Chapter and sponsored by IEEE Electronics Packaging Society (EPS). EPTC 2019 will feature keynotes, a panel session, Invited talks, technical sessions, short courses, forums, an exhibition, social and networking activities. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in the Asia-Pacific and is well attended by experts in all aspects of packaging technology from all over the world. EPTC is now the flagship conference of IEEE EPS in Region 10.

EPTC 2019 Program includes technical presentations contributed by distinguished speakers from industry, academia and research institutions. A complementary conference banquet will be held in Marina Bay Sands, the conference hotel. For easy access to the conference venue and a comfortable stay in Singapore, we have engaged with Marina Bay Sands to offer specially-discounted room prices via here

 

EPTC 2019 Registration details can be found here

EPTC 2019 Advance program can be found here

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ESTC

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. This international event brings together both academics and industry leaders to present and discuss the state-of the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.

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Most Popular Articles according to Xplore® usage statistics

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria ; William J. Otter ; Jonathan Hazell ; Brendan T. W. Gillatt ; Callum Long-Collins ; Nick M. Ridler ; Stepan Lucyszyn

Publication Year: 2015, Page(s):1339 - 1349 


A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Tao Zhang ; Lianming Li ; Haiyang Xia ; Xujun Ma ; Tie Jun Cui

Publication Year: 2018, Page(s):1281 – 1291


Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Wen Tao Li ; Yong Qiang Hei ; Peter Mack Grubb ; Xiao-Wei Shi ;Ray T. Chen

Publication Year: 2018, Page(s):1695 – 1701

 

A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Hui Chu ; Yong-Xin Guo

Publication Year: 2017, Page(s):964 – 973


Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau ; Ming Li ; Margie Li Qingqian ; Tony Chen ; Iris Xu ;Qing Xiang Yong ; Zhong Cheng ; Nelson Fan ; Eric Kuah ; Zhang Li ; Kim Hwee Tan ; Yiu-Ming Cheung ; Eric Ng ; Penny Lo ; Wu Kai ; Ji Hao ; Koh Sau Wee ; Jiang Ran ; Cao Xi ; Rozalia Beica ;Sze Pei Lim ; N. C. Lee ; Cheng-Ta Ko ; Henry Yang ; Yu-Hua Chen ; Mian Tao ; Jeffery Lo ; Ricky S. W. Lee

 

Publication Year: 2018, Page(s):1544 – 1560

 

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