ESTC Call For Papers

ESTC

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. This international event brings together both academics and industry leaders to present and discuss the state-of the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.

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