IEEE EPS Thermal and Mechanical Technical Committee
Chair: Dereje Agonafer
Website: under construction: https://cmte.ieee.org/eps-tmm/
The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:
- Electronic Cooling and Thermal Management of Component and System
- Thermal Design and Analysis
- Coupled Electro-Thermal Phenomena
- Thermal and Thermomechanical Measurements
- Thermal Mismatches and Stressses
- Temperature Induced Fracture and Moisture Stresses in IC Package
- Thermomechanical Design and Analysis of Component and System
- Thermomechanical Computer Aided Design and Engineering
- Co-Design
- Heterogeneous Integration