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EPS is pleased to congratulate the recently elected Members at Large (MALs) who will serve a three-year term from January 1, 2022 through December 31, 2024.

These MALs and the regions they were elected to represent are:

Regions 1-6, 7, 9:

Benson Chan

Pradeep Lall

Wolfgang Sauter

 

Region 10:

Chih-Pin (C.P.) Hung

Chuan Seng Tan

Kishio Yokouchi

 

EPS thanks these members for their leadership and willingness to serve.

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). It aims to provide a platform for the dissemination of innovations and new developments in semiconductor packaging and component technology, from design to manufacturing. Since its inauguration in 1997, EPTC has been established as a highly reputed electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region 10. It covers diverse areas of electronics packaging technology including modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration, and smart manufacturing. EPTC2021 features keynotes, technology  talks, invited presentations, technical presentations, sponsorship & exhibition corners, and virtual networking activities.

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The Pittsburgh EPS Chapter is holding an online meeting during the evening of November 17, 2021 on "Tethered Power Systems for Lunar Mobility and Power Transmission" given by Ansel Barchowsky, Ph.D. Power Subsystems Electronics Engineer, Jet Propulsion Laboratory, California Institute of Technology.

Registger Here  Open to IEEE and EPS members

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Environmental Sustainability for FHE & Microelectronics

Instructor Dr. Toni Mattila

Sustainability will be a focus area funding in the next SEMI FlexTech Request for Proposals. To assist SEMI & FlexTech members in formulating their proposals and partnerships, we bring you this course on Environmental Sustainability for FHE & Microelectronics.

Sustainability is more a way of thinking than a technological solution. To achieve sustainability, a company must develop a comprehensive approach that covers multiple levels and segments of its business.

Join this course to develop an understanding of the essential components of industrial carbon footprint and discuss actions companies and industry can take to reduce theirs. Throughout the course, Dr. Mattila particular attention to the electronics industry; what the sector has already contributed and what remains to be achieved.

Register here

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WIE

In honor of the IEEE Women in Engineering 25th anniversary in 2022, the WIE 25th anniversary sub-committee is holding a "Women-to-Women Tech Ideas Dedicated to Women" competition. This competition will highlight the strengths, knowledge, ideas, and creativity that help solve technical problems around the world.

 

Do you have an innovative idea you would like to submit to the competition? Upload your ideas by 5 December 2021 for review, and a possible opportunity to present your idea to an audience of women in tech at the IEEE WIE International Leadership Conference in San Diego, USA in June 2022. 

25th Anniversary W-To-W Innovative Ideas Application Form

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The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.

The ESTC 2022 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.

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Nils F. Nissen, Member, IEEE

Abstract— The electronics industry needs to take a closer look at its contribution to global environmental impacts, in particular to climate changing emissions and achieving carbon neutrality. Packaging technologies and packaging experts have a crucial role to play, even though the highest environmental impacts do not originate from the packaging sector.

 Index Terms— sustainable, green electronics, energy, hybrid electronics, stretchable electronics, 3D printing, additive manufacturing

I.               INTRODUCTION

 Action against climate change is more pressing than ever – and is recognized not only by more political players, but also by industry. The electronics industry has long had the luxury of presenting itself as a clean industry, and as an active part of solving sustainability questions rather than adding to the problems.

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Title: ML/AI in Semiconductor Packaging and Electronics Manufacturing

Date: 7th Dec 2021 (Tuesday)

Time: 10.00am – 11.00am (M’sia Time, GMT +8:00)

Platform: CISCO WebEx

Presenter: Dr. Dongkai Shangguan, IEEE Fellow, IMAPS Fellow, IEEE EPS Distinguished Lecturer

 

Abstract:

In the era of “More than Moore” and heterogeneous integration, many advanced semiconductor packaging processes have presented challenges in manufacturing. For example, precision alignment has been one of the key capabilities for several advanced technologies for heterogeneous integration, such as 2.5D/3D, optical assembly, etc.

This talk will present several important applications of ML/AI in semiconductor packaging, optical assembly, PCB assembly and other areas in electronics manufacturing. Applications such as traceability, predictive maintenance, productivity improvement, and process optimization, will be discussed. Various use cases will be discussed to demonstrate how an ML/AI platform at the Edge can be utilized to significantly improve the machine performance as well as yield and throughput for challenging processes. In particular, the presentation will focus on the application of ML/AI for precision alignment using real-time data routinely generated by the machine. Future industry perspectives will be outlined.

Register here Open to Everyone

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