The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by IEEE Electronics Packaging Society (EPS). It aims to provide a platform for the dissemination of innovations and new developments in semiconductor packaging and component technology, from design to manufacturing. Since its inauguration in 1997, EPTC has been established as a highly reputed electronics packaging conference and is the EPS flagship conference in the Asia-Pacific Region 10. It covers diverse areas of electronics packaging technology including modules, components, materials, equipment technology, assembly, reliability, interconnect design, device and systems packaging, heterogeneous integration, wafer-level packaging, flexible electronics, LED, IoT, 5G, autonomous vehicles, photonics, emerging technologies, 2.5D/3D integration, and smart manufacturing. EPTC2021 features keynotes, technology talks, invited presentations, technical presentations, sponsorship & exhibition corners, and virtual networking activities.