The 2023 IEEE EPS membership certificates are now available.
Steps to download and print your certificate:
- Log into IEEE Collabratec at ieeecollabratec.org
- Click on your name in the top right of the screen and select “IEEE Membership Certificates”.
- From the “Member Certificates” page select your certificate to download the PDF.
- Open the PDF and print.
The 24th IEEE Electronics Packaging Technology Conference (EPTC2022) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapter. It is co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has evolved over the years into a highly reputed electronics packaging conference in Asia.
EPTC 2022 will be held on 7-9 December 2022 in Singapore. It is an in-person event featuring live presentations (keynotes, panel discussion, invited presentations, workshop and professional development courses) as well as an exhibition from the industrial partners. An added highlight will be a dinner & social event at Mount Faber, the perfect spot to enjoy the sunset and panoramic views of Sentosa Island. Also, more than 200 technical and poster presentations covering all important aspects of electronics packaging listed below will be presented:
• Advanced Packaging
• TSV/Wafer Level Packaging
• Interconnection Technologies
• Emerging Technologies
• Materials and Processing
• Assembly and Manufacturing Technology
• Electrical Simulation & Characterization
• Mechanical Simulation & Characterization
• Thermal Management& Cooling Solutions
• Quality, Reliability & Failure Analysis
• Advanced Optoelectronics and Displays.
• Smart Manufacturing and Equipment Technology
Please visit www.eptc-ieee.net for the preliminary program and conference registration details
International 3D Power Electronics Integration and Manufacturing Symposium
February 1 – 3, 2023
Florida International University, Miami, FL
IEEE and PSMA invite you to attend the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-2023). This Symposium provides the opportunity to drive future power electronics solutions for increased density and performance. Discover advances in the design, package integration and manufacturing of 3D power sources. Technical Sessions include modeling, active and passive components, substrates, packaging and how to integrate them with 3D manufacturing technologies to create state of the art power sources.The Symposium will be held February 1-3, 2023, at Florida International University, Miami, FL, USA., offering an opportunity to get a “winter warm-up” on Florida’s enticing beaches.
The special session “Co-Design for Chiplets” was held during the 31st Conference on Electrical Performance of Electronic Packaging and Systems at the San Jose Marriot Hotel on October 10, 2022.
Heterogeneous integration (HI) is bringing a revolutionary change rather than an evolutionary one. The electronic design automation (EDA) will need to undergo transformational changes to manage these new challenges and simple incremental changes to their existing infrastructure may not be sufficient. To address these concerns and others related to HI, several visionaries from industry presented their perspectives at the panel session.
Prith Banerjee, chief technology officer at Ansys, presented his talk entitled “Future of Simulation Driven Innovation in Nanotechnology”.
The remarkable advances in computational science and engineering (CSE) fueled in part by the persistent increases in the capabilities of computer hardware and software have produced a large and expanding set of computational methods to quantify the electrical performance of electronic packages. Methods such as FEM, MoM, PEEC, FDTD etc. are available through various commercial, academic, freeware, and proprietary simulation tools and continue to be developed, refined, marketed, and applied to the electromagnetic analysis and design of packages. While these tools advance, the expectations from these simulation tools continue to escalate partly because the requirements from and complexity of electronic packages continue to increase. Recognizing
• the importance of simulation tools and computational methods to the development of electronic packages,
• the necessity of verification, validation, and objective comparison to the proper use and further advancement of these tools and methods,
During the third edition of the Electronics Week, organized by IEEE Hu&Ro, EPS & NTC Joint Chapter, held in Bucharest between October 24-28, 2022, took place joint events TIE and TIE M that gathered students and teaching staff from universities as well as companies of the electronics industry from Romania. On this occasion, the first edition of TIE M was launched, edition dedicated to the CAD design of the mechanical subassembly of an electronic product. TIE M complements the well-known TIE event, which is focused on the CAD aspects of PCB design, now in its 31st edition.
Both events have the main purpose of familiarizing students from the mechanics or electronics majors with the specifics of the engineering profession involved in the design of electronic modules.
It should be emphasized that both the subject/topics given to the students participating in TIE M and those from TIE were developed by engineers involved in the electronics industry. And, the results evaluation teams were made up of both teaching staff and design engineers from the industry. In fact, the events represent a very good opportunity to be certified, by the industry, the student knowledge regarding the design of an electronics package. The presence of the teaching staff during the entire events and their direct involvement in the evaluation teams, offer them a wonderful environment to be in contact with the needed design requirements on an electronic package design engineer.
The next edition of the electronics week will take place in Craiova between October 16 and 20, 2023.
We recall the 45th ISSE - International Spring Seminar on Electronics Technology, held in Hotel Springer Schlössl, Vienna, from May 11 to May 15, 2022 and announce the 46th ISSE taking place from May 10 to May 14, 2023 in Timisoara, Romania. The International Spring Seminar on Electronics Technology (ISSE) is one of the renowned conferences organized as an IEEE EPS conference event with a four and a half decades long tradition encompassing all topics around electronics technology and is attended every year by more than 100 experts and particularly young researchers from all over the world.
Since the Corona pandemic came over Europe in March 2020, the two ISSE events in 2020 (organized by Alena Pietrikova and hear team at University of Technology in Kosice, Slovakia) and in 2021 (Organized by Heinz Wohlrabe and this team at TU Dresden, Germany) were held as a two-days webbased conference with a condensed technical program.
Nov 22, 2022 - Nov 22, 2022
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Dec 7, 2022 - Dec 9, 2022
24th Electronics Packaging Technology Conference (EPTC)
Dec 7, 2022 - Dec 9, 2022
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Dec 12, 2022 - Dec 14, 2022
2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
Dec 18, 2022 - Dec 21, 2022